Yves Danto

According to our database1, Yves Danto authored at least 26 papers between 1997 and 2007.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2007
Dynamic void formation in a DD-copper-structure with different metallization geometry.
Microelectron. Reliab., 2007

Torsion test applied for reballing and solder paste volume evaluation.
Microelectron. Reliab., 2007

2006
Improved physical understanding of intermittent failure in continuous monitoring method.
Microelectron. Reliab., 2006

Multi-level Modeling of Hot Carrier Injection for Reliability.
Proceedings of the Forum on specification and Design Languages, 2006

2005
Electroluminescence spectroscopy for reliability investigations of 1.55 mum bulk semiconductor optical amplifier.
Microelectron. Reliab., 2005

Vibration lifetime modelling of PCB assemblies using steinberg model.
Microelectron. Reliab., 2005

2004
Study of influence of failure modes on lifetime distribution prediction of 1.55 μm DFB Laser diodes using weak drift of monitored parameters during ageing tests.
Microelectron. Reliab., 2004

How to study delamination in plastic encapsulated devices.
Microelectron. Reliab., 2004

Reliability of Low-Cost PCB Interconnections for Telecommunication Applications.
Microelectron. Reliab., 2004

2003
An improved method for automatic detection and location of defects in electronic components using scanning ultrasonic microscopy.
IEEE Trans. Instrum. Meas., 2003

Moisture diffusion in BCB resins used for MEMS packaging.
Microelectron. Reliab., 2003

Ageing simulation of MOSFET circuit using a VHDL-AMS behavioural modelling: an experimental case study.
Microelectron. Reliab., 2003

Impact of 1.55 mum laser diode degradation laws on fibre optic system performances using a system simulator.
Microelectron. Reliab., 2003

Three-dimensional FEM simulations of thermomechanical stresses in 1.55 mum Laser modules.
Microelectron. Reliab., 2003

Reliability estimation of BGA and CSP assemblies using degradation law model and technological parameters deviations.
Microelectron. Reliab., 2003

Simulation of time depending void formation in copper, aluminum and tungsten plugged via structures.
Microelectron. Reliab., 2003

A physical approach on SCOBIC investigation in VLSI.
Microelectron. Reliab., 2003

Application of Picosecond Ultrasonics to Non-Destructive Analysis in VLSI circuits.
Microelectron. Reliab., 2003

Reliability simulation of electronic circuits with VHDL-AMS.
Proceedings of the Forum on specification and Design Languages, 2003

2002
Behavioral study of passive components and coating materials under isostatic pressure and temperature stress conditions.
Microelectron. Reliab., 2002

Contribution to ageing simulation of complex analogue circuit using VHDL-AMS behavioural modelling language.
Microelectron. Reliab., 2002

Evaluation of a micropackaging analysis technique by highfrequency microwaves.
Microelectron. Reliab., 2002

High temperature reliability testing of aluminum and tantalum electrolytic capacitors.
Microelectron. Reliab., 2002

Acoustic analysis of an assembly: Structural identification by signal processing (wavelets).
Microelectron. Reliab., 2002

Behavioral Modeling of Analogue and Mixed Integrated Systems with VHDL-AMS for RF Applications.
Proceedings of the 15th Annual Symposium on Integrated Circuits and Systems Design, 2002

1997
A World-Wide-Web based instrumentation pool real testing in a virtual world.
Proceedings of the 1997 IEEE International Conference on Microelectronic Systems Education, 1997


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