H. Naganuma

According to our database, H. Naganuma authored at least 4 papers between 2010 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Impact of 3-D integration process on memory retention characteristics in thinned DRAM chip for 3-D memory.

Kang Wook Lee, Seiya Tanikawa, Mariappan Murugesan, H. Naganuma, Jichoel Bea, Takafumi Fukushima, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

A 37 × 37 pixels artificial retina chip with edge enhancement function for 3-D stacked fully implantable retinal prosthesis.

H. Naganuma, Kouji Kiyoyama, Tetsu Tanaka

Proceedings of the 2012 IEEE Biomedical Circuits and Systems Conference, 2012

2011

A very low area ADC for 3-D stacked CMOS image processing system.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, H. Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

A block-parallel signal processing system for CMOS image sensor with three-dimensional structure.

Kouji Kiyoyama, Kang Wook Lee, Takafumi Fukushima, H. Naganuma, Hiroaki Kobayashi, Tetsu Tanaka, Mitsumasa Koyanagi

Proceedings of the IEEE International Conference on 3D System Integration, 2010