John U. Knickerbocker

According to our database, John U. Knickerbocker authored at least 15 papers between 1991 and 2020.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2020

Back to Finger-Writing: Fingertip Writing Technology Based on Pressure Sensing.

Gaddi Blumrosen, Katsuyuki Sakuma, John Jeremy Rice, John U. Knickerbocker

IEEE Access, 2020

2019

Turning the Finger into a Writing Tool.

Katsuyuki Sakuma, Gaddi Blumrosen, John Jeremy Rice, Jeff Rogers, John U. Knickerbocker

Proceedings of the 41st Annual International Conference of the IEEE Engineering in Medicine and Biology Society, 2019

2012

An 8x 10-Gb/s Source-Synchronous I/O System Based on High-Density Silicon Carrier Interconnects.

Timothy O. Dickson, Yong Liu, Sergey V. Rylov, Bing Dang, Cornelia K. Tsang, Paul S. Andry, John F. Bulzacchelli, Herschel A. Ainspan, Xiaoxiong Gu, Lavanya Turlapati, Michael P. Beakes, Benjamin D. Parker, John U. Knickerbocker, Daniel J. Friedman

IEEE J. Solid State Circuits, 2012

2011

Technologies for exascale systems.

Paul W. Coteus, John U. Knickerbocker, Chung H. Lam, Yurii A. Vlasov

IBM J. Res. Dev., 2011

2008

Thermomechanical modeling of 3D electronic packages.

Sri M. Sri-Jayantha, Gerald McVicker, Kerry Bernstein, John U. Knickerbocker

IBM J. Res. Dev., 2008

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections.

Katsuyuki Sakuma, Paul S. Andry, Cornelia K. Tsang, Steven L. Wright, Bing Dang, Chirag S. Patel, Bucknell C. Webb, J. Maria, Edmund J. Sprogis, S. K. Kang, Robert J. Polastre, Raymond R. Horton, John U. Knickerbocker

IBM J. Res. Dev., 2008

Three-dimensional silicon integration.

John U. Knickerbocker, Paul S. Andry, Bing Dang, Raymond R. Horton, Mario J. Interrante, Chirag S. Patel, Robert J. Polastre, Katsuyuki Sakuma, Ranjani Sirdeshmukh, Edmund J. Sprogis, Sri M. Sri-Jayantha, Antonio M. Stephens, Anna W. Topol, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright

IBM J. Res. Dev., 2008

Preface.

John U. Knickerbocker

IBM J. Res. Dev., 2008

3D chip stacking with C4 technology.

Bing Dang, Steven L. Wright, Paul S. Andry, Edmund J. Sprogis, Cornelia K. Tsang, M. John Interrante, Bucknell C. Webb, Robert J. Polastre, Raymond R. Horton, Chirag S. Patel, Arun Sharma, J. Zheng, Katsuyuki Sakuma, John U. Knickerbocker

IBM J. Res. Dev., 2008

2006

3-D Silicon Integration and Silicon Packaging Technology Using Silicon Through-Vias.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, John M. Cotte

IEEE J. Solid State Circuits, 2006

2005

Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection.

John U. Knickerbocker, Paul S. Andry, L. Paivikki Buchwalter, Alina Deutsch, Raymond R. Horton, Keith A. Jenkins, Young Hoon Kwark, Gerald McVicker, Chirag S. Patel, Robert J. Polastre, Christian D. Schuster, Arun Sharma, Sri M. Sri-Jayantha, Christopher W. Surovic, Cornelia K. Tsang, Bucknell C. Webb, Steven L. Wright, Samuel R. McKnight, Edmund J. Sprogis, Bing Dang

IBM J. Res. Dev., 2005

Three dimensional silicon integration using fine pitch interconnection, silicon processing and silicon carrier packaging technology.

John U. Knickerbocker, Chirag S. Patel, Paul S. Andry, Cornelia K. Tsang, L. Paivikki Buchwalter, Edmund J. Sprogis, Hua Gan, Raymond R. Horton, Robert J. Polastre, Steven L. Wright, Christian D. Schuster, Christian W. Baks, Fuad E. Doany, Joanna Rosner, Steven Cordes

Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005

2002

An advanced multichip module (MCM) for high-performance UNIX servers.

John U. Knickerbocker, Frank L. Pompeo, Alice F. Tai, Donald L. Thomas, Roger D. Weekly, Michael G. Nealon, Harvey C. Hamel, Anand Haridass, James N. Humenik, Richard A. Shelleman, Srinivasa N. Reddy, Kevin M. Prettyman, Benjamin V. Fasano, Sudipta K. Ray, Thomas E. Lombardi, Kenneth C. Marston, Patrick A. Coico, Peter J. Brofman, Lewis S. (Lew) Goldmann, David L. Edwards, Jeffrey A. Zitz, Sushumna Iruvanti, Subhash L. Shinde, Hai P. Longworth

IBM J. Res. Dev., 2002

1992

High-performance glass-ceramic/copper multilayer substrate with thin-film redistribution.

Rao R. Tummala, John U. Knickerbocker, Sarah H. Knickerbocker, L. Wynn Herron, Robert W. Nufer, Raj N. Master, Mark O. Neisser, Benedikt M. Kellner, Charles H. Perry, James N. Humenik, Thomas F. Redmond

IBM J. Res. Dev., 1992

1991

IBM System/390 air-cooled alumina thermal conduction module.

John U. Knickerbocker, George B. Leung, William R. Miller, Steven P. Young, Scott A. Sands, Richard F. Indyk

IBM J. Res. Dev., 1991