Jian Gao
Orcid: 0000-0001-5625-7751Affiliations:
- Guangdong University of Technology, MOE, Key Laboratory of Precision Microelectronic Manufacturing Technology and Equipment, Guangzhou, China
- University of Nottingham, School of Materials, Mechanical and Manufacturing Engineering, UK (PhD 2002)
According to our database1,
Jian Gao
authored at least 37 papers
between 2006 and 2023.
Collaborative distances:
Collaborative distances:
Timeline
Legend:
Book In proceedings Article PhD thesis Dataset OtherLinks
Online presence:
-
on orcid.org
On csauthors.net:
Bibliography
2023
A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding.
IEEE Trans. Ind. Electron., September, 2023
Multim. Tools Appl., April, 2023
A Novel Defocus-Degree-Based Phase Unwrapping and Fusion Algorithm for High-Speed and Large-Depth-Range 3D Measurement.
IEEE Trans. Ind. Electron., 2023
2022
Novel Dynamic Microactuation Method for Tracking-Error Reduction of Permanent Magnet Linear Synchronous Motors.
IEEE Trans. Ind. Electron., 2022
Hybrid Position/Force Fully Closed-Loop Control of a Flip-Chip Soft-Landing Bonding System.
IEEE Trans. Ind. Electron., 2022
Development of a Novel Intelligent Adjustable Vision Algorithm for LED Chip Repairing.
IEEE Trans. Ind. Electron., 2022
Development and Testing of a Large-Stroke Nanopositioning Stage With Linear Active Disturbance Rejection Controller.
IEEE Trans Autom. Sci. Eng., 2022
2021
A Fast Self-Correction Method for Nonlinear Sinusoidal Fringe Images in 3-D Measurement.
IEEE Trans. Instrum. Meas., 2021
IEEE Trans. Ind. Electron., 2021
A Flip-Chip Alignment System With the Property of Deviation Self-Correction at the Nanoscale.
IEEE Trans. Ind. Electron., 2021
Event-Triggered Adaptive Control Design With Prescribed Performance for Macro-Micro Composite Positioning Stage.
IEEE Trans. Ind. Electron., 2021
Vibratory Feeding Performance Improvement Through Discrete Element Analysis for High-Speed Optical Detection of LED Chips.
IEEE Access, 2021
IEEE Access, 2021
2020
A Novel Self-Feedback Intelligent Vision Measure for Fast and Accurate Alignment in Flip-Chip Packaging.
IEEE Trans. Ind. Informatics, 2020
Multim. Tools Appl., 2020
Rationally Designing the Trace of Wire Bonder Head for Large-Span-Ratio Wire Bonding in 3D Stacked Packaging.
IEEE Access, 2020
2019
A Stable Autoregressive Moving Average Hysteresis Model in Flexure Fast Tool Servo Control.
IEEE Trans Autom. Sci. Eng., 2019
Comput. Math. Methods Medicine, 2019
Triangular Model Registration Algorithm Through Differential Topological Singularity Points by Helmholtz-Hodge Decomposition.
IEEE Access, 2019
Dynamic Modeling, Simulation, and Experimental Verification of a Wafer Handling SCARA Robot With Decoupling Servo Control.
IEEE Access, 2019
2018
A Rapid Dynamic Positioning Method for Settling Time Reduction Through a Macro-Micro Composite Stage With High Positioning Accuracy.
IEEE Trans. Ind. Electron., 2018
Development and Repetitive-Compensated PID Control of a Nanopositioning Stage With Large-Stroke and Decoupling Property.
IEEE Trans. Ind. Electron., 2018
High Dynamic Control of a Flexure Fast Tool Servo Using On-line Sequential Extreme Learning Machine.
Proceedings of the 2018 IEEE/ASME International Conference on Advanced Intelligent Mechatronics, 2018
2017
A Rapid Vibration Reduction Method for Macro-Micro Composite Precision Positioning Stage.
IEEE Trans. Ind. Electron., 2017
Imbalanced defect classification for mobile phone screen glass using multifractal features and a new sampling method.
Multim. Tools Appl., 2017
Review and Comparison of High-Dynamic Range Three-Dimensional Shape Measurement Techniques.
J. Sensors, 2017
Cutter location path generation through an improved algorithm for machining triangular mesh.
Comput. Aided Des., 2017
Automatic surface defect detection for mobile phone screen glass based on machine vision.
Appl. Soft Comput., 2017
A direct-drive SCARA robot for wafer&ceramic-substrate handling based on visual servoing.
Proceedings of the 2017 IEEE International Conference on Cybernetics and Intelligent Systems (CIS) and IEEE Conference on Robotics, 2017
A regularized on-line sequential extreme learning machine with forgetting property for fast dynamic hysteresis modeling.
Proceedings of the 2017 IEEE/RSJ International Conference on Intelligent Robots and Systems, 2017
Proceedings of the IEEE International Conference on Advanced Intelligent Mechatronics, 2017
2016
A new sampling method for classifying imbalanced data based on support vector machine ensemble.
Neurocomputing, 2016
2014
IEEE Trans. Ind. Electron., 2014
2012
Proceedings of the Intelligent Robotics and Applications - 5th International Conference, 2012
2010
T2: A novel two Degree-of-Freedom translational parallel robot for pick-and-place operation.
Proceedings of the 8th IEEE International Conference on Control and Automation, 2010
2008
Proceedings of the 2008 IEEE Conference on Robotics, Automation and Mechatronics, 2008
2006
Adaptive restoration of complex geometry parts through reverse engineering application.
Adv. Eng. Softw., 2006