Perceval Coudrain

According to our database, Perceval Coudrain authored at least 13 papers between 2011 and 2021.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2021

IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

IEEE J. Solid State Circuits, 2021

2020

2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm² Inter-Chiplet Interconnects and 156mW/mm²@ 82%-Peak-Efficiency DC-DC Converters.

Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2016

Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits.

Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy

IEEE Des. Test, 2016

Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes.

Cristiano Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, Lee Wang

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Heat spreading packaging solutions for hybrid bonded 3D-ICs.

Rafael Prieto, Perceval Coudrain, Jean-Philippe Colonna, Y. Hallez, Christian Chancel, V. Rat, Sylvain Dumas, G. Romano, R. Franiatte, C. Brunet-Manquiat, Séverine Cheramy, Alexis Farcy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015

Graphite-based heat spreaders for hotspot mitigation in 3D ICs.

Cristiano Santos, Rafael Prieto, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Reis

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Thermal performance of 3D ICs: Analysis and alternatives.

Cristiano Santos, Pascal Vivet, Jean-Philippe Colonna, Perceval Coudrain, Ricardo Augusto da Luz Reis

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Using TSVs for thermal mitigation in 3D circuits: Wish and truth.

Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Advances toward reliable high density Cu-Cu interconnects by Cu-SiO₂ direct hybrid bonding.

Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.

Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS.

Perrine Batude, Thomas Ernst, Julien Arcamone, Gregory Arndt, Perceval Coudrain, Pierre-Emmanuel Gaillardon

IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

2011

3D integration demonstration of a wireless product with design partitioning.

G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011