Perceval Coudrain
Orcid: 0000-0003-1727-4529
According to our database1,
Perceval Coudrain
authored at least 13 papers
between 2011 and 2021.
Collaborative distances:
Collaborative distances:
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Bibliography
2021
IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management.
IEEE J. Solid State Circuits, 2021
2020
2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm<sup>2</sup> Inter-Chiplet Interconnects and 156mW/mm<sup>2</sup>@ 82%-Peak-Efficiency DC-DC Converters.
Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020
2016
IEEE Des. Test, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016
2015
Proceedings of the 2015 International 3D Systems Integration Conference, 2015
2014
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO<sub>2</sub> direct hybrid bonding.
Proceedings of the 2014 International 3D Systems Integration Conference, 2014
2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013
2012
3-D Sequential Integration: A Key Enabling Technology for Heterogeneous Co-Integration of New Function With CMOS.
IEEE J. Emerg. Sel. Topics Circuits Syst., 2012
2011
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011