Jean Michailos

According to our database, Jean Michailos authored at least 6 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2019

Challenges and capabilities of 3D integration in CMOS imaging sensors.

Dominique Thomas, Jean Michailos, Krysten Rochereau

Proceedings of the 49th European Solid-State Device Research Conference, 2019

2017

A 4 × 4 × 2 Homogeneous Scalable 3D Network-on-Chip Circuit With 326 MFlit/s 0.66 pJ/b Robust and Fault Tolerant Asynchronous 3D Links.

Pascal Vivet, Yvain Thonnart, Romain Lemaire, Cristiano Santos, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Denis Dutoit, Fabien Clermidy, Séverine Cheramy, Abbas Sheibanyrad, Frédéric Pétrot, Eric Flamand, Jean Michailos, Alexandre Arriordaz, Lee Wang, Juergen Schloeffel

IEEE J. Solid State Circuits, 2017

2016

8.1 A 4×4×2 homogeneous scalable 3D network-on-chip circuit with 326MFlit/s 0.66pJ/b robust and fault-tolerant asynchronous 3D links.

Pascal Vivet, Yvain Thonnart, Romain Lemaire, Edith Beigné, Christian Bernard, Florian Darve, Didier Lattard, Ivan Miro Panades, Cristiano Santos, Fabien Clermidy, Séverine Cheramy, Frédéric Pétrot, Eric Flamand, Jean Michailos

Proceedings of the 2016 IEEE International Solid-State Circuits Conference, 2016

ITAC: A complete 3D integration test platform.

Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy

Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2013

Thermal correlation between measurements and FEM simulations in 3D ICs.

Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

3D integration demonstration of a wireless product with design partitioning.

G. Druais, Pascal Ancey, C. Aumont, V. Caubet, Laurent-Luc Chapelon, C. Chaton, Séverine Cheramy, S. Cordova, E. Cirot, Jean-Philippe Colonna, Perceval Coudrain, T. Divel, Y. Dodo, Alexis Farcy, N. Guitard, K. Haxaire, Nicolas Hotellier, F. Leverd, R. Liou, Jean Michailos, A. Ostrovsky, Sebastien Petitdidier, J. Pruvost, D. Riquet, O. Robin, E. Saugier, Nicolas Sillon

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011