Shih-Chi Yang

According to our database, Shih-Chi Yang authored at least 2 papers between 2011 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Thermo-Mechanical Stress and Its Effect on the Fabrication and Reliability of Cu-SiO2 Hybrid Bonds for 3D IC Heterogeneous Integration (Invited).

Chih Chen, Shih-Chi Yang, You-Yi Lin, Huai-En Lin, Dinh-Phuc Tran

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2011

A high-performance low VMIN 55nm 512Kb disturb-free 8T SRAM with adaptive VVSS control.

Hao-I Yang, Shih-Chi Yang, Mao-Chih Hsia, Yung-Wei Lin, Yi-Wei Lin, Chien-Hen Chen, Chi-Shin Chang, Geng-Cing Lin, Yin-Nien Chen, Ching-Te Chuang, Wei Hwang, Shyh-Jye Jou, Nan-Chun Lien, Hung-Yu Li, Kuen-Di Lee, Wei-Chiang Shih, Ya-Ping Wu, Wen-Ta Lee, Chih-Chiang Hsu

Proceedings of the IEEE 24th International SoC Conference, SOCC 2011, Taipei, Taiwan, 2011