Songyu Sun

Orcid: 0000-0003-1203-8324

According to our database1, Songyu Sun authored at least 16 papers between 2022 and 2026.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

On csauthors.net:

Bibliography

2026
Machine Learning-Assisted VCD Processing for Accelerated Dynamic Voltage Drop Analysis.
ACM Trans. Design Autom. Electr. Syst., July, 2026

CD-FiLM: Contrastive Masked Decoder With Feature-Wise Linear Modulation for Power-Signal Integrity Co-Analysis of High-Speed Transmitters.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., June, 2026

FreqCache: Accelerating Embodied VLN Models with Adaptive Frequency-Guided Token Caching.
CoRR, April, 2026

Understanding and Predicting Vmin Failures in Power Delivery Networks through Multi-Order Droop Signatures.
Proceedings of the 31st Asia and South Pacific Design Automation Conference, 2026

2025
LiTformer: Efficient Signal Integrity Analysis for High-Speed Link Transmitters Using Non-Autoregressive Transformer.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., December, 2025

SPIRAL+: Efficient Signal-Power Integrity Co-Analysis for Interchiplet Links Validation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., August, 2025

Fast Machine-Learning-Driven Supply Noise-Aware Macromodeling for High-Speed Nonlinear Drivers.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., March, 2025

Accelerating Electro-Thermal Co-Analysis via Coarse-to-Fine Physics-Informed Neural Networks.
Proceedings of the IEEE/ACM International Conference On Computer Aided Design, 2025

2024
A Parallel Simulation Framework Incorporating Machine Learning-Based Hotspot Detection for Accelerated Power Grid Analysis.
Proceedings of the 2024 ACM/IEEE International Symposium on Machine Learning for CAD, 2024

Single-Ferroelectric FET based Associative Memory for Data-Intensive Pattern Matching.
Proceedings of the 25th International Symposium on Quality Electronic Design, 2024

LiTformer: Efficient Modeling and Analysis of High-Speed Link Transmitters Using Non-Autoregressive Transformer.
Proceedings of the 43rd IEEE/ACM International Conference on Computer-Aided Design, 2024

SPIRAL: Signal-Power Integrity Co-Analysis for High-Speed Inter-Chiplet Serial Links Validation.
Proceedings of the 29th Asia and South Pacific Design Automation Conference, 2024

2023
Hybrid Robotic Grasping With a Soft Multimodal Gripper and a Deep Multistage Learning Scheme.
IEEE Trans. Robotics, June, 2023

A Fast Method to Estimate Through-Bump Current for Power Delivery Verification.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., May, 2023

Virtual histological staining of unlabeled autopsy tissue.
CoRR, 2023

2022
Unidirectional Imaging using Deep Learning-Designed Materials.
CoRR, 2022


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