Hervé Morel

Orcid: 0000-0001-7866-0437

According to our database1, Hervé Morel authored at least 23 papers between 2001 and 2024.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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On csauthors.net:

Bibliography

2024
Physics-Based Strategies for Fast TDDB Testing and Lifetime Estimation in SiC Power MOSFETs.
IEEE Trans. Ind. Electron., May, 2024

2023
Robust Regulation of a Power Flow Controller via Nonlinear Integral Action.
IEEE Trans. Control. Syst. Technol., July, 2023

Full-SiC Single-Chip Buck and Boost MOSFET-JBS Converters for Ultimate Efficient Power Vertical Integration.
Proceedings of the 30th International Conference on Mixed Design of Integrated Circuits and System, 2023

2022
Comprehensive characterization of vertical GaN-on-GaN Schottky barrier diodes.
Microelectron. J., 2022

2021
Robust Output Set-Point Tracking for a Power Flow Controller via Forwarding Design.
Proceedings of the 2021 60th IEEE Conference on Decision and Control (CDC), 2021

2019
VTH-Hysteresis and Interface States Characterisation in SiC Power MOSFETs with Planar and Trench Gate.
Proceedings of the IEEE International Reliability Physics Symposium, 2019

A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices.
Proceedings of the IECON 2019, 2019

2018
Measurement and analysis of SiC-MOSFET threshold voltage shift.
Microelectron. Reliab., 2018

Threshold voltage instability in SiC MOSFETs as a consequence of current conduction in their body diode.
Microelectron. Reliab., 2018

<i>V</i><sub><i>TH</i></sub> subthreshold hysteresis technology and temperature dependence in commercial 4H-SiC MOSFETs.
Microelectron. Reliab., 2018

Robustness study of 1700 V 45 mΩ SiC MOSFETs.
Proceedings of the IEEE International Conference on Industrial Technology, 2018

2017
A Novel Approach to Accurately Determine the t<sub>q</sub> Parameter of Thyristors.
IEEE Trans. Ind. Electron., 2017

High temperature ageing of microelectronics assemblies with SAC solder joints.
Microelectron. Reliab., 2017

Lifetime of power electronics interconnections in accelerated test conditions: High temperature storage and thermal cycling.
Microelectron. Reliab., 2017

SiC power devices packaging with a short-circuit failure mode capability.
Microelectron. Reliab., 2017

On the extraction of the design parameters of power BJTs.
Proceedings of the International Conference on Control, Automation and Diagnosis, 2017

2016
Avalanche robustness of SiC Schottky diode.
Microelectron. Reliab., 2016

2015
A Novel Approach to Extract the Thyristor Design Parameters for Designing of Power Electronic Systems.
IEEE Trans. Ind. Electron., 2015

Study of short-circuit robustness of SiC MOSFETs, analysis of the failure modes and comparison with BJTs.
Microelectron. Reliab., 2015

2011
Inverse Models of Voltage and Current Probes.
IEEE Trans. Instrum. Meas., 2011

2010
Analysis of Power Switching Losses Accounting Probe Modeling.
IEEE Trans. Instrum. Meas., 2010

Characterization, Modeling and Design Parameters Identification of Silicon Carbide Junction Field Effect Transistor for Temperature Sensor Applications.
Sensors, 2010

2001
On the validity of the standard SPICE model of the diode for simulation in power electronics.
IEEE Trans. Ind. Electron., 2001


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