Tsunaaki Shidei

According to our database, Tsunaaki Shidei authored at least 8 papers between 2011 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of three.

2019

Real Chip Performance Evaluation on Through Chip Interface IP for Renesas SOTB 65nm Process.

Hideto Kayashima, Takuya Kojima, Hayate Okuhara, Tsunaaki Shidei, Hideharu Amano

Proceedings of the Seventh International Symposium on Computing and Networking Workshops, 2019

2016

An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories.

Atsutake Kosuge, Junki Hashiba, Toru Kawajiri, So Hasegawa, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda, Ken Takeuchi

IEEE J. Solid State Circuits, 2016

2015

Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory.

Atsutake Kosuge, Junki Hashiba, Toru Kawajiri, So Hasegawa, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda, Ken Takeuchi

Proceedings of the Symposium on VLSI Circuits, 2015

2014

A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler.

Atsutake Kosuge, Wataru Mizuhara, Tsunaaki Shidei, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2014

2013

A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler.

Wataru Mizuhara, Tsunaaki Shidei, Atsutake Kosuge, Tsutomu Takeya, Noriyuki Miura, Masao Taguchi, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

2012

6 W/25 mm² Wireless Power Transmission for Non-contact Wafer-Level Testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

IEICE Trans. Electron., 2012

2011

A 0.55 V 10 fJ/bit Inductive-Coupling Data Link and 0.7 V 135 fJ/Cycle Clock Link With Dual-Coil Transmission Scheme.

Noriyuki Miura, Tsunaaki Shidei, Yuxiang Yuan, Shusuke Kawai, Keita Takatsu, Yuji Kiyota, Yuichi Asano, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2011

6W/25mm² inductive power transfer for non-contact wafer-level testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2011