Yoichi Yoshida

According to our database, Yoichi Yoshida authored at least 13 papers between 2008 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of three.

2012

6 W/25 mm² Wireless Power Transmission for Non-contact Wafer-Level Testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

IEICE Trans. Electron., 2012

2011

6W/25mm² inductive power transfer for non-contact wafer-level testing.

Andrzej Radecki, Hayun Chung, Yoichi Yoshida, Noriyuki Miura, Tsunaaki Shidei, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2011

A 2.7Gb/s/mm² 0.9pJ/b/chip 1coil/channel ThruChip interface with coupled-resonator-based CDR for NAND Flash memory stacking.

Noriyuki Miura, Yasuhiro Take, Mitsuko Saito, Yoichi Yoshida, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2011

2010

47% Power Reduction and 91% Area Reduction in Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking.

Mitsuko Saito, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

IEEE Trans. Circuits Syst. I Regul. Pap., 2010

An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing.

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Masayuki Mizuno, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2010

2 Gb/s 15 pJ/b/chip Inductive-Coupling Programmable Bus for NAND Flash Memory Stacking.

Mitsuko Saito, Yasufumi Sugimori, Yoshinori Kohama, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2010

Analysis of Inductive Coupling and Design of Rectifier Circuit for Inter-Chip Wireless Power Link.

Yuxiang Yuan, Yoichi Yoshida, Tadahiro Kuroda

IEICE Trans. Electron., 2010

A 6Gb/s receiver with discrete-time based channel filtering for wireline FDM communications.

Tsutomu Takeya, Kazuhisa Sunaga, Koichi Yamaguchi, Hideyuki Sugita, Yoichi Yoshida, Masayuki Mizuno, Tadahiro Kuroda

Proceedings of the IEEE Custom Integrated Circuits Conference, 2010

2009

Wireless DC voltage transmission using inductive-coupling channelfor highly-parallel wafer-level testing.

Yoichi Yoshida, Koichi Nose, Yoshihiro Nakagawa, Koichiro Noguchi, Yasuhiro Morita, Masamoto Tago, Tadahiro Kuroda, Masayuki Mizuno

Proceedings of the IEEE International Solid-State Circuits Conference, 2009

A 2Gb/s 15pJ/b/chip Inductive-Coupling programmable bus for NAND Flash memory stacking.

Yasufumi Sugimori, Yoshinori Kohama, Mitsuko Saito, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Takayasu Sakurai, Tadahiro Kuroda

Proceedings of the IEEE International Solid-State Circuits Conference, 2009

MuCCRA-Cube: A 3D dynamically reconfigurable processor with inductive-coupling link.

Shotaro Saito, Yoshinori Kohama, Yasufumi Sugimori, Yohei Hasegawa, Hiroki Matsutani, Toru Sano, Kazutaka Kasuga, Yoichi Yoshida, Kiichi Niitsu, Noriyuki Miura, Tadahiro Kuroda, Hideharu Amano

Proceedings of the 19th International Conference on Field Programmable Logic and Applications, 2009

47% power reduction and 91% area reduction in inductive-coupling programmable bus for NAND flash memory stacking.

Mitsuko Saito, Yasufumi Sugimori, Yoshinori Kohama, Yoichi Yoshida, Noriyuki Miura, Hiroki Ishikuro, Tadahiro Kuroda

Proceedings of the IEEE Custom Integrated Circuits Conference, 2009

2008

A 2 Gb/s Bi-Directional Inter-Chip Data Transceiver With Differential Inductors for High Density Inductive Channel Array.

Yoichi Yoshida, Noriyuki Miura, Tadahiro Kuroda

IEEE J. Solid State Circuits, 2008