Atsutake Kosuge

According to our database1, Atsutake Kosuge authored at least 21 papers between 2012 and 2020.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

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Article 
PhD thesis 
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Links

On csauthors.net:

Bibliography

2020
A 1200×1200 8-Edges/Vertex FPGA-Based Motion-Planning Accelerator for Dual-Arm-Robot Manipulation Systems.
Proceedings of the IEEE Symposium on VLSI Circuits, 2020

2019
An Object-Pose Estimation Acceleration Technique for Picking Robot Applications by Using Graph-Reusing k-NN Search.
Proceedings of the First International Conference on Graph Computing, 2019

A 4.8x Faster FPGA-Based Iterative Closest Point Accelerator for Object Pose Estimation of Picking Robot Applications.
Proceedings of the 27th IEEE Annual International Symposium on Field-Programmable Custom Computing Machines, 2019

2016
A 280 Mb/s In-Vehicle LAN System Using Electromagnetic Clip Connector and High-EMC Transceiver.
IEEE Trans. Circuits Syst. I Regul. Pap., 2016

A 6 Gb/s 6 pJ/b 5 mm-Distance Non-Contact Interface for Modular Smartphones Using Two-Fold Transmission Line Coupler and High EMC Tolerant Pulse Transceiver.
IEEE J. Solid State Circuits, 2016

An Inductively Powered Wireless Solid-State Drive System With Merged Error Correction of High-Speed Wireless Data Links and NAND Flash Memories.
IEEE J. Solid State Circuits, 2016

Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO.
IEICE Trans. Electron., 2016

A 1 Tb/s/mm<sup>2</sup> inductive-coupling side-by-side chip link.
Proceedings of the ESSCIRC Conference 2016: 42<sup>nd</sup> European Solid-State Circuits Conference, 2016

Analytical thruchip inductive coupling channel design optimization.
Proceedings of the 21st Asia and South Pacific Design Automation Conference, 2016

2015
Analysis and Design of an 8.5-Gb/s/Link Multi-Drop Bus Using Energy-Equipartitioned Transmission Line Couplers.
IEEE Trans. Circuits Syst. I Regul. Pap., 2015

A Study of Physical Design Guidelines in ThruChip Inductive Coupling Channel.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2015

Inductively-powered wireless solid-state drive (SSD) system with merged error correction of high-speed non-contact data links and NAND flash memory.
Proceedings of the Symposium on VLSI Circuits, 2015

10.1 A 6Gb/s 6pJ/b 5mm-distance non-contact interface for modular smartphones using two-fold transmission-line coupler and EMC-qualified pulse transceiver.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

24.4 A 6.5Gb/s Shared bus using electromagnetic connectors for downsizing and lightening satellite processor system by 60%.
Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015

Circuit and package design for 44GB/s inductive-coupling DRAM/SoC interface.
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

Design and analysis for ThruChip design for manufacturing (DFM).
Proceedings of the 20th Asia and South Pacific Design Automation Conference, 2015

2014
A 0.15-mm-Thick Noncontact Connector for MIPI Using a Vertical Directional Coupler.
IEEE J. Solid State Circuits, 2014

30.6 An electromagnetic clip connector for in-vehicle LAN to reduce wire harness weight by 30%.
Proceedings of the 2014 IEEE International Conference on Solid-State Circuits Conference, 2014

2013
A 0.15mm-thick non-contact connector for MIPI using vertical directional coupler.
Proceedings of the 2013 IEEE International Solid-State Circuits Conference, 2013

A 12.5Gb/s/link non-contact multi drop bus system with impedance-matched Transmission Line Couplers and Dicode partial-response channel transceivers.
Proceedings of the 18th Asia and South Pacific Design Automation Conference, 2013

2012
A 7Gb/s/link non-contact memory module for multi-drop bus system using energy-equipartitioned coupled transmission line.
Proceedings of the 2012 IEEE International Solid-State Circuits Conference, 2012


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