William van den Daele

According to our database, William van den Daele authored at least 2 papers between 2013 and 2014.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2014

Superior performance and Hot Carrier reliability of Strained FDSOI nMOSFETs for advanced CMOS technology nodes.

Guillaume Besnard, Xavier Garros, François Andrieu, Phuong Nguyen, William van den Daele, Patrick Reynaud, Walter Schwarzenbach, Daniel Delprat, Konstantin Bourdelle, Gilles Reimbold, Sorin Cristoloveanu

Proceedings of the 44th European Solid State Device Research Conference, 2014

2013

Novel low temperature 3D wafer stacking technology for high density device integration.

Ionut Radu, Gweltaz Gaudin, William van den Daele, Fabrice Letertre, Carlos Mazure, Léa Di Cioccio, Thomas Lacave, Frederic Mazen, Pascal Scheiblin, Thomas Signamarcheix, Sorin Cristoloveanu

Proceedings of the European Solid-State Device Research Conference, 2013