Yangyin Chen
According to our database1,
Yangyin Chen
authored at least 3 papers
between 2016 and 2022.
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Bibliography
2022
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.
Proceedings of the IEEE International Reliability Physics Symposium, 2022
Thermally stable, packaged aware LV HKMG platforms benchmark to enable low power I/O for next 3D NAND generations.
Proceedings of the IEEE International Memory Workshop, 2022
2016
Proceedings of the 46th European Solid-State Device Research Conference, 2016