Kris Croes

According to our database, Kris Croes authored at least 66 papers between 1989 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Novel Low Thermal Budget CMOS RMG: Performance and Reliability Benchmark Against Conventional High Thermal Budget Gate Stack Solutions.

Jacopo Franco, Hiroaki Arimura, J.-F. de Marneffe, S. Brus, Romain Ritzenthaler, E. Dentoni Litta, Kris Croes, Ben Kaczer, N. Horiguchi

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

Challenges for Interconnect Reliability: From Element to System Level.

Olalla Varela Pedreira, Houman Zahedmanesh, Youqi Ding, Ivan Ciofi, Kristof Croes

Proceedings of the 2023 International Symposium on Physical Design, 2023

A pragmatic network-aware paradigm for system-level electromigration predictions at scale.

Houman Zahedmanesh, Philippe Roussel, Ivan Ciofi, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Impact of via geometry and line extension on via-electromigration in nano-interconnects.

A. S. Saleh, Houman Zahedmanesh, Hajdin Ceric, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Towards accurate temperature prediction in BEOL for reliability assessment (Invited).

Melina Lofrano, Herman Oprins, Xinyue Chang, Bjorn Vermeersch, Olalla Varela Pedreira, Alicja Lesniewska, Vladimir Cherman, Ivan Ciofi, Kristof Croes, Seongho Park, Zsolt Tokei

Proceedings of the IEEE International Reliability Physics Symposium, 2023

Thermomigration-induced void formation in Cu-interconnects - Assessment of main physical parameters.

Youqi Ding, O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, T. Chavez, Hosain Farr, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM.

Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil Komalan, Houman Zahedmanesh, Kristof Croes, Tommaso Marinelli, José Ignacio Gómez Pérez, Timon Evenblij, Gouri Sankar Kar, Francky Catthoor

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 2022

Degradation mechanisms and lifetime assessment of Ge Vertical PIN photodetectors.

Kristof Croes, Veerle Simons, Brecht Truijen, Philippe Roussel, Koen Van Sever, Artemisia Tsiara, Jacopo Franco, Philippe Absil

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

Analyzing the Electromigration Challenges of Computation in Resistive Memories.

Mahta Mayahinia, Mehdi B. Tahoori, Manu Perumkunnil, Kristof Croes, Francky Catthoor

Proceedings of the IEEE International Test Conference, 2022

System-Level Simulation of Electromigration in a 3 nm CMOS Power Delivery Network: The Effect of Grid Redundancy, Metallization Stack and Standard-Cell Currents.

Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Kristof Croes, Mustafa Badaroglu

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Degradation mechanisms in Germanium Electro-Absorption Modulators.

Artemisia Tsiara, Alicja Lesniewska, Philippe Roussel, Srinivasan Ashwyn Srinivasan, Mathias Berciano, Marko Simicic, Marianna Pantouvaki, Joris Van Campenhout, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Assessment of critical Co electromigration parameters.

O. Varela Pedreira, Melina Lofrano, Houman Zahedmanesh, Philippe J. Roussel, Marleen H. van der Veen, Veerle Simons, Emmanuel Chery, Ivan Ciofi, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2022

Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.

Lin Hou, Emmanuel Chery, Kristof Croes, Davide Tierno, Soon Aik Chew, Yangyin Chen, Peter Rakbin, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021

A Novel System-Level Physics-Based Electromigration Modelling Framework: Application to the Power Delivery Network.

Houman Zahedmanesh, Ivan Ciofi, Odysseas Zografos, Mustafa Badaroglu, Kristof Croes

Proceedings of the ACM/IEEE International Workshop on System Level Interconnect Prediction, 2021

Electromigration limits of copper nano-interconnects.

Houman Zahedmanesh, Olalla Varela Pedreira, Zsolt Tokei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Reliability of Mo as Word Line Metal in 3D NAND.

Davide Tierno, Kristof Croes, Arjun Ajaykumar, Siva Ramesh, Geert Van den Bosch, Maarten Rosmeulen

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Reliability of a DME Ru Semidamascene scheme with 16 nm wide Airgaps.

Alicja Lesniewska, Olalla Varela Pedreira, Melina Lofrano, Gayle Murdoch, Marleen H. van der Veen, Anish Dangol, Naoto Horiguchi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2021

Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paper.

Jacopo Franco, Hiroaki Arimura, J.-F. de Marneffe, A. Vandooren, L.-Å. Ragnarsson, Zhicheng Wu, Dieter Claes, E. Dentoni Litta, N. Horiguchi, Kris Croes, Dimitri Linten, Tibor Grasser, Ben Kaczer

Proceedings of the International Conference on IC Design and Technology, 2021

2020

Electrical and Optical Reliability Analysis of GeSi Electro-Absorption Modulators.

Artemisia Tsiara, S. A. Srinivasan, S. Balakrishnan, Marianna Pantouvaki, Philippe Absil, Joris Van Campenhout, Kris Croes

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

Conduction and Breakdown Mechanisms in Low-k Spacer and Nitride Spacer Dielectric Stacks in Middle of Line Interconnects.

Chen Wu, Adrian Vaisman Chasin, Steven Demuynck, Naoto Horiguchi, Kris Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Metal reliability mechanisms in Ruthenium interconnects.

Olalla Varela Pedreira, Michele Stucchi, Anshul Gupta, Victor Vega-Gonzalez, Marleen van der Veen, Stephane Lariviere, Christopher J. Wilson, Zsolt Tökei, Kristof Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Physics based modeling of bimodal electromigration failure distributions and variation analysis for VLSI interconnects.

Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi B. Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.

Alicja Lesniewska, Philippe J. Roussel, Davide Tierno, Victor Vega-Gonzalez, Marleen H. van der Veen, Patrick Verdonck, Nicolas Jourdan, Christopher J. Wilson, Zsolt Tökei, Kris Croes

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Role of Defects in the Reliability of HfO2/Si-Based Spacer Dielectric Stacks for Local Interconnects.

Chen Wu, Adrian Vaisman Chasin, Andrea Padovani, Alicja Lesniewska, Steven Demuynck, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Variation-Aware Physics-Based Electromigration Modeling and Experimental Calibration for VLSI Interconnects.

Sarath Mohanachandran Nair, Rajendra Bishnoi, Mehdi Baradaran Tahoori, Houman Zahedmanesh, Kristof Croes, Kevin Garello, Gouri Sankar Kar, Francky Catthoor

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Accelerated Device Degradation of High-Speed Ge Waveguide Photodetectors.

Alicja Lesniewska, S. A. Srinivasan, Joris Van Campenhout, Barry J. O'Sullivan, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

New Access to Soft Breakdown Parameters of Low-k Dielectrics Through Localisation-Based Analysis.

Norbert Herfurth, Anne Beyreuther, Elham Amini, Christian Boit, Michél Simon-Najasek, Susanne Hübner, Frank Altmann, R. Herfurth, Chen Wu, Ingrid De Wolf, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Understanding EM-Degradation Mechanisms in Metal Heaters Used for Si Photonics Applications.

Kris Croes, Veerle Simons, Sofie Beyne, Vladimir Cherman, Herman Oprins, Michele Stucchi, Philippe Absil, A. Glabman, Eric Wilcox

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Low-Frequency Noise Measurements to Characterize Cu-Electromigration Down to 44nm Metal Pitch.

Sofie Beyne, Olalla Varela Pedreira, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2019

2018

SOT-MRAM 300mm integration for low power and ultrafast embedded memories.

Kevin Garello, Farrukh Yasin, S. Couet, Laurent Souriau, Johan Swerts, Sidharth Rao, Simon Van Beek, Wonsub Kim, Enlong Liu, Shreya Kundu, Diana Tsvetanova, N. Jossart, Kris Croes, E. Grimaldi, M. Baumgartner, D. Crotti, Arnaud Furnémont, Pietro Gambardella, Gouri Sankar Kar

CoRR, 2018

SOT-MRAM 300MM Integration for Low Power and Ultrafast Embedded Memories.

Kevin Garello, Kevin Garello Yasin, S. Couet, Laurent Souriau, Johan Swerts, Sidharth Rao, Simon Van Beek, Wonsub Kim, Enlong Liu, Shreya Kundu, Diana Tsvetanova, Kris Croes, N. Jossart, E. Grimaldi, M. Baumgartner, D. Crotti, Arnaud Fumemont, Pietro Gambardella, Gouri Sankar Kar

Proceedings of the 2018 IEEE Symposium on VLSI Circuits, 2018

Silicon Photonics for 56G NRZ Optical Interconnects.

Joris Van Campenhout, Yoojin Ban, Peter De Heyn, Ashwyn Srinivasan, Jeroen De Coster, Sebastien Lardenois, Brad Snyder, Sadhishkumar Balakrishnan, Guy Lepage, Negin Golshani, Sofie Janssen, Alicja Lesniewska, Kristof Croes, Andy Miller, Peter Verheyen, Marianna Pantouvaki, Philippe Absil

Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

Insights into metal drift induced failure in MOL and BEOL.

Chen Wu, O. Varela Pedreira, Alicja Lesniewska, Yunlong Li, Ivan Ciofi, Zsolt Tökei, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

TSV process-induced MOS reliability degradation.

Yunlong Li, Michele Stucchi, Stefaan Van Huylenbroeck, Geert Van der Plas, Gerald Beyer, Eric Beyne, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Method to assess the impact of LER and spacing variation on BEOL dielectric reliability using 2D-field simulations for <20nm spacing.

Deniz Kocaay, Philippe Roussel, Kristof Croes, Ivan Ciofi, Alicja Lesniewska, Ingrid De Wolf

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Stress mitigation of 3D-stacking/packaging induced stresses.

Kristof Croes, Vladimir Cherman, Melina Lofrano, Houman Zahedmanesh, Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Zsolt Tökei, Eric Beyne

Proceedings of the IEEE International Reliability Physics Symposium, 2018

The first observation of p-type electromigration failure in full ruthenium interconnects.

Sofie Beyne, Shibesh Dutta, Olalla Varela Pedreira, Niels Bosman, Christoph Adelmann, Ingrid De Wolf, Zsolt Tökei, Kristof Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

LER and spacing variability on BEOL TDDB using E-field mapping: Impact of field acceleration.

Deniz Kocaay, Philippe Roussel, Kris Croes, Ivan Ciofi, Y. Saad, Ingrid De Wolf

Microelectron. Reliab., 2017

Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects.

Luka Kljucar, Mario Gonzalez, Kristof Croes, Ingrid De Wolf, Joke De Messemaeker, Gayle Murdoch, Philip Nolmans, Joeri De Vos, Jürgen Bömmels, Eric Beyne, Zsolt Tökei

Microelectron. Reliab., 2017

Lock-in thermal laser stimulation for non-destructive failure localization in 3-D devices.

Kristof J. P. Jacobs, T. Wang, Michele Stucchi, Mario Gonzalez, Kris Croes, Ingrid De Wolf, Eric Beyne

Microelectron. Reliab., 2017

2016

Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip-package interaction; a numerical investigation.

Houman Zahedmanesh, Mario Gonzalez, Ivan Ciofi, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line.

Luka Kljucar, Mario Gonzalez, Ingrid De Wolf, Kristof Croes, Jürgen Bömmels, Zsolt Tökei

Microelectron. Reliab., 2016

Reliability Challenges Related to TSV Integration and 3-D Stacking.

Kristof Croes, Joke De Messemaeker, Yunlong Li, Wei Guo, Olalla Varela Pedreira, Vladimir Cherman, Michele Stucchi, Ingrid De Wolf, Eric Beyne

IEEE Des. Test, 2016

2015

Microstructure simulation of grain growth in Cu through silicon vias using phase-field modeling.

Nabi Nabiollahi, Nele Moelans, Mario Gonzalez, Joke De Messemaeker, Christopher J. Wilson, Kristof Croes, Eric Beyne, Ingrid De Wolf

Microelectron. Reliab., 2015

Constant voltage electromigration for advanced BEOL copper interconnects.

Baojun Tang, Kris Croes, Nicolas Jourdan, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf, Eric Wilcox, Timothy McMullen

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Intrinsic reliability of local interconnects for N7 and beyond.

Kris Croes, Alicja Lesniewska, Chen Wu, Ivan Ciofi, Agnieszka Banczerowska, B. Briggs, S. Demuynck, Zsolt Tökei, Jürgen Bömmels, Y. Saad, W. Gao

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Impact of process variability on BEOL TDDB lifetime model assessment.

Kris Croes, Deniz Kocaay, Ivan Ciofi, Jürgen Bömmels, Zsolt Tökei

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

As-grown donor-like traps in low-k dielectrics and their impact on intrinsic TDDB reliability.

Baojun Tang, Kris Croes, Yohan Barbarin, Yunqi Wang, Robin Degraeve, Yunlong Li, Maria Toledano-Luque, Thomas Kauerauf, Jürgen Bömmels, Zsolt Tökei, Ingrid De Wolf

Microelectron. Reliab., 2014

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias.

Yunlong Li, Stefaan Van Huylenbroeck, Els Van Besien, Xiaoping Shi, Chen Wu, Michele Stucchi, Gerald Beyer, Eric Beyne, Ingrid De Wolf, Kristof Croes

Microelectron. Reliab., 2014

Design Technology co-optimization for N10.

Julien Ryckaert, Praveen Raghavan, Rogier Baert, Marie Garcia Bardon, Mircea Dusa, Arindam Mallik, Sushil Sakhare, Boris Vandewalle, Piet Wambacq, Bharani Chava, Kris Croes, Morin Dehan, Doyoung Jang, Philippe Leray, Tsung-Te Liu, Kenichi Miyaguchi, Bertrand Parvais, Pieter Schuddinck, Philippe Weemaes, Abdelkarim Mercha, Jürgen Bömmels, Naoto Horiguchi, Greg McIntyre, Aaron Thean, Zsolt Tökei, Shaunee Cheng, Diederik Verkest, An Steegen

Proceedings of the IEEE 2014 Custom Integrated Circuits Conference, 2014

2013

TEASE: a systematic analysis framework for early evaluation of FinFET-based advanced technology nodes.

Arindam Mallik, Paul Zuber, Tsung-Te Liu, Bharani Chava, Bhavana Ballal, Pablo Royer Del Bario, Rogier Baert, Kris Croes, Julien Ryckaert, Mustafa Badaroglu, Abdelkarim Mercha, Diederik Verkest

Proceedings of the 50th Annual Design Automation Conference 2013, 2013

2012

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2012

2011

Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne

Microelectron. Reliab., 2011

Influence of test structure design on stress-induced-voiding using an experimentally validated Finite Element Modeling approach.

Melina Lofrano, Kris Croes, Ingrid De Wolf, Christopher J. Wilson

Microelectron. Reliab., 2011

2009

Automated Pathfinding tool chain for 3D-stacked integrated circuits: Practical case study.

Dragomir Milojevic, Trevor E. Carlson, Kris Croes, Riko Radojcic, Diana F. Ragett, Dirk Seynhaeve, Federico Angiolini, Geert Van der Plas, Paul Marchal

Proceedings of the IEEE International Conference on 3D System Integration, 2009

2008

Study of copper drift during TDDB of intermetal dielectrics by using fully passivated MOS capacitors as test vehicle.

Kristof Croes, G. Cannatá, L. Zhao, Zsolt Tökei

Microelectron. Reliab., 2008

A tool flow for predicting system level timing failures due to interconnect reliability degradation.

Jin Guo, Antonis Papanikolaou, Michele Stucchi, Kristof Croes, Zsolt Tokei, Francky Catthoor

Proceedings of the 18th ACM Great Lakes Symposium on VLSI 2008, 2008

2006

Hardware and a Tool Chain for ADRES.

Bjorn De Sutter, Bingfeng Mei, T. Andrei Bartic, Tom Vander Aa, Mladen Berekovic, Jean-Yves Mignolet, Kris Croes, Paul Coene, Miro Cupac, Aïssa Couvreur, Andy Folens, Steven Dupont, Bert Van Thielen, Andreas Kanstein, Hong-Seok Kim, Sukjin Kim

Proceedings of the Reconfigurable Computing: Architectures and Applications, 2006

2002

High-resolution SILC measurements of thin SiO₂ at ultra low voltages.

Stefano Aresu, Ward De Ceuninck, R. Dreesen, Kris Croes, E. Andries, Jean Manca, Luc De Schepper, Robin Degraeve, Ben Kaczer, Marc D'Olieslaeger

Microelectron. Reliab., 2002

Statistical aspects of the degradation of LDD nMOSFETs.

E. Andries, R. Dreesen, Kris Croes, Ward De Ceuninck, Luc De Schepper, Guido Groeseneken, K. F. Lo, Marc D'Olieslaeger, Jan D'Haen

Microelectron. Reliab., 2002

2001

A new degradation model and lifetime extrapolation technique for lightly doped drain nMOSFETs under hot-carrier degradation.

R. Dreesen, Kris Croes, Jean Manca, Ward De Ceuninck, Luc De Schepper, A. Pergoot, Guido Groeseneken

Microelectron. Reliab., 2001

High-resolution in-situ of gold electromigration: test time reduction.

Kris Croes, R. Dreesen, Jean Manca, Ward De Ceuninck, Luc De Schepper, Luc Tielemans, P. J. van der Wel

Microelectron. Reliab., 2001

1999

Matisse: A System-on-Chip Design Methodology Emphasizing Dynamic Memory Management.

Diederik Verkest, Julio Leao da Silva Jr., Chantal Ykman-Couvreur, Kris Croes, Miguel Miranda, Sven Wuytack, Francky Catthoor, Gjalt G. de Jong, Hugo De Man

J. VLSI Signal Process., 1999

1998

Efficient System Exploration and Synthesis of Applications with Dynamic Data Storage and Intensive Data Transfer.

Julio Leao da Silva Jr., Chantal Ykman-Couvreur, Miguel Miranda, Kris Croes, Sven Wuytack, Gjalt G. de Jong, Francky Catthoor, Diederik Verkest, Paul Six, Hugo De Man

Proceedings of the 35th Conference on Design Automation, 1998

1989

REDUSA: module generation by automatic elimination of superfluous blocks in regular structures.

I. Vandeweerd, Kris Croes, Luc Rijnders, Paul Six, Hugo De Man

IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1989