Davide Tierno

Orcid: 0000-0003-4915-904X

According to our database1, Davide Tierno authored at least 3 papers between 2020 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2022
Reliability Investigation of W2W Hybrid Bonding Interface: Breakdown Voltage and Leakage Mechanism.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Reliability of Mo as Word Line Metal in 3D NAND.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru Fill.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020


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