Yeow Kheng Lim

According to our database, Yeow Kheng Lim authored at least 4 papers between 2009 and 2025.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2025

A Spatial-Physics Informed Model for 3D Spiral Sample Scanned by SQUID Microscopy.

J. Senthilnath, Jayasanker Jayabalan, Zhuoyi Lin, Aye Phyu Phyu Aung, Chen Hao, Kaixin Xu, Yeow Kheng Lim, F. C. Wellstood

CoRR, July, 2025

2022

A Wafer Scale Hybrid Integration Platform for Co-packaged Photonics using a CMOS based Optical Interposer^TM.

Suresh Venkatesan, James Lee, Simon Chun Kiat Goh, Brian Pile, Daniel Meerovich, Jinyu Mo, Yang Jing, Lucas Soldano, Baochang Xu, Yu Zhang, Aaron Voon-Yew Thean, Yeow Kheng Lim

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2009

Underfill selection methodology for fine pitch Cu/low-k FCBGA packages.

Xuefen Ong, Soon Wee Ho, Yue Ying Ong, Leong Ching Wai, Kripesh Vaidyanathan, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Juan Boon Tan, Dong Kyun Sohn, Liang Choo Hsia, Zhong Chen

Microelectron. Reliab., 2009