K. W. Lee

According to our database, K. W. Lee authored at least 15 papers between 1987 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of five.

2023

Development and Product Reliability Characterization of Advanced High Speed 14nm DDR5 DRAM with On-die ECC.

S. Lee, N.-H. Lee, K. W. Lee, J. H. Kim, J. H. Jin, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2023

2022

Transistor Reliability Characterization for Advanced DRAM with HK+MG & EUV process technology.

Nam-Hyun Lee, S. Lee, S.-H. Kim, G.-J. Kim, K. W. Lee, Y. S. Lee, Y. C. Hwang, H. S. Kim, S. Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2022

2015

Mitigating thermo mechanical stress in high-density 3D-LSI through dielectric liners in Cu- through silicon Via _ µ-RS and µ-XRD study.

Mariappan Murugesan, Jichoel Bea, Hiroyuki Hashimoto, K. W. Lee, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Reconfigured multichip-on-wafer (mCoW) Cu/oxide hybrid bonding technology for ultra-high density 3D integration using recessed oxide, thin glue adhesive, and thin metal capping layers.

K. W. Lee, Chisato Nagai, Ai Nakamura, Hiroki Aizawa, Ji Chel Bea, Mitsumasa Koyanagi, Hideto Hashiguchi, Takafumi Fukushima, Tanaka Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Advanced 2.5D/3D hetero-integration technologies at GINTI, Tohoku University.

K. W. Lee, Ji Chel Bea, Mitsu Koyanagi, Takafumi Fukushima, Tetsu Tanaka

Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2014

Micro-XRD investigation of fine-pitch Cu-TSV induced thermo-mechanical stress in high-density 3D-LSI.

Mariappan Murugesan, Takafumi Fukushima, Ji Chel Bea, K. W. Lee, Mitsu Koyanagi, Y. Imai, S. Kimura, Tetsu Tanaka

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

Effects of electro-less Ni layer as barrier/seed layers for high reliable and low cost Cu TSV.

K. W. Lee, Chisato Nagai, Ai Nakamura, Ji Chel Bea, Mariappan Murugesan, Takafumi Fukushima, Tanaka Tanaka, Mitsumasa Koyanagi

Proceedings of the 2014 International 3D Systems Integration Conference, 2014

2010

FISST-SLAM: Finite Set Statistical Approach to Simultaneous Localization and Mapping.

Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma

Int. J. Robotics Res., 2010

A random finite set based detection and tracking using 3D LIDAR in dynamic environments.

Bharath Kalyan, K. W. Lee, W. Sardha Wijesoma, Diluka Moratuwage, Nicholas M. Patrikalakis

Proceedings of the IEEE International Conference on Systems, 2010

2009

Joint use of DEA and constrained canonical correlation analysis for efficiency valuations involving categorical variables.

K. S. Park, K. W. Lee, M. S. Park, D. Kim

J. Oper. Res. Soc., 2009

2004

Roadmap constrained SLAM in neighborhood environment.

Javier Ibañez-Guzmán, W. Sardha Wijesoma, K. W. Lee

Proceedings of the 8th International Conference on Control, 2004

2000

Stochastic models for random-request availability.

K. W. Lee

IEEE Trans. Reliab., 2000

1995

Optimising neural network weights using genetic algorithms: a case study.

K. W. Lee, H. N. Lam

Proceedings of International Conference on Neural Networks (ICNN'95), Perth, WA, Australia, November 27, 1995

Optimal Sizing of Feedforward Neural Networks: Case Studies.

K. W. Lee, H. N. Lam

Proceedings of the 2nd New Zealand Two-Stream International Conference on Artificial Neural Networks and Expert Systems (ANNES '95), 1995

1987

TDX-1: A Distributed System Architecture for High Throughout Telephone Switching.

W. Yu, S. Y. Kang, K. W. Lee

Proceedings of the COMPCON'87, 1987