Andreas Arp

According to our database, Andreas Arp authored at least 3 papers between 2007 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design-Technology Co-Optimizations for Power, Area, and Reliability.

Gerald Strevig, David Wolpert, Leon Sigal, Bill Huott, Mark Cichanowski, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Matthias Pflanz, Daniel Kiss, Simon Büchsenstein, Tobias Werner, Philipp Salz, Michael Romain, Richard E. Serton, Nick Jing, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Rahul M. Rao, Christopher J. Berry, Amanda Venton, Elazar Kachir, Andreas Arp

IEEE J. Solid State Circuits, January, 2026

2025

2.2 IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator.

Gerald Strevig, Christopher J. Berry, Rahul M. Rao, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Eduard Herkel, Matthias Pflanz, Patrick J. Meaney, Michael Romain, Mark Cichanowski, Amanda Venton, David Wolpert, Elazar Kachir, Luke Hopkins, Tim E. Bubb, Andreas Arp, Daniel Kiss, Simon Büchsenstein, Michael H. Wood, Michael Spear, Robert J. Sonnelitter, Rajiv Joshi

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2007

Inkjettable conductive adhesive for use in microelectronics and microsystems technology.

Jana Kolbe, Andreas Arp, Francesco Calderone, Edouard Marc Meyer, Wilhelm Meyer, Helmut Schaefer, Manuela Stuve

Microelectron. Reliab., 2007