Philipp Salz

According to our database, Philipp Salz authored at least 4 papers between 2017 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design-Technology Co-Optimizations for Power, Area, and Reliability.

Gerald Strevig, David Wolpert, Leon Sigal, Bill Huott, Mark Cichanowski, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Matthias Pflanz, Daniel Kiss, Simon Büchsenstein, Tobias Werner, Philipp Salz, Michael Romain, Richard E. Serton, Nick Jing, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Rahul M. Rao, Christopher J. Berry, Amanda Venton, Elazar Kachir, Andreas Arp

IEEE J. Solid State Circuits, January, 2026

2025

37.1 IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area, and Reliability.

David Wolpert, Gerry Strevig, Christopher J. Berry, Leon J. Sigal, Bill Huott, Mark Cichanowski, Matthias Pflanz, Tobias Werner, Philipp Salz, Nick Jinq, Michael Romain, Iris Leefken, Richard E. Serton, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Stefan Hougardy, Ben Klotz, Rahul M. Rao

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2022

POWER10™: A 16-Core SMT8 Server Processor With 2TB/s Off-Chip Bandwidth in 7nm Technology.

Rahul M. Rao, Christopher J. Gonzalez, Eric Fluhr, Abraham Mathews, Andrew Bianchi, Daniel Dreps, David Wolpert, Eric Lai, Gerald Strevig, Glen A. Wiedemeier, Philipp Salz, Ryan Kruse

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2017

A system of array families and synthesized soft arrays for the POWER9™ processor in 14nm SOI FinFET technology.

Philipp Salz, A. Frisch, Wolfgang Penth, J. Noack, T. Kalla, Rolf Sautter, Michael Kugel, Otto A. Torreiter, G. Sapp, Mike Lee, Eric Fluhr, A. Rozenfeld, Jürgen Pille, Dieter F. Wendel

Proceedings of the 43rd IEEE European Solid State Circuits Conference, 2017