Mark Cichanowski

According to our database, Mark Cichanowski authored at least 9 papers between 2015 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design-Technology Co-Optimizations for Power, Area, and Reliability.

Gerald Strevig, David Wolpert, Leon Sigal, Bill Huott, Mark Cichanowski, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Matthias Pflanz, Daniel Kiss, Simon Büchsenstein, Tobias Werner, Philipp Salz, Michael Romain, Richard E. Serton, Nick Jing, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Rahul M. Rao, Christopher J. Berry, Amanda Venton, Elazar Kachir, Andreas Arp

IEEE J. Solid State Circuits, January, 2026

2025

2.2 IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator.

Gerald Strevig, Christopher J. Berry, Rahul M. Rao, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Eduard Herkel, Matthias Pflanz, Patrick J. Meaney, Michael Romain, Mark Cichanowski, Amanda Venton, David Wolpert, Elazar Kachir, Luke Hopkins, Tim E. Bubb, Andreas Arp, Daniel Kiss, Simon Büchsenstein, Michael H. Wood, Michael Spear, Robert J. Sonnelitter, Rajiv Joshi

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

37.1 IBM Telum II Processor Design-Technology Co-Optimizations for Power, Performance, Area, and Reliability.

David Wolpert, Gerry Strevig, Christopher J. Berry, Leon J. Sigal, Bill Huott, Mark Cichanowski, Matthias Pflanz, Tobias Werner, Philipp Salz, Nick Jinq, Michael Romain, Iris Leefken, Richard E. Serton, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Stefan Hougardy, Ben Klotz, Rahul M. Rao

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2022

IBM Telum: a 16-Core 5+ GHz DCM.

Ofer Geva, Christopher J. Berry, Robert J. Sonnelitter, David Wolpert, Adam Collura, Thomas Strach, Di Phan, Cédric Lichtenau, Alper Buyuktosunoglu, Hubert Harrer, Jeffrey A. Zitz, Chad Marquart, Douglas Malone, Tobias Webel, Adam Jatkowski, John Isakson, Dina Hamid, Mark Cichanowski, Michael Romain, Faisal Hasan, Kevin Williams, Jesse Surprise, Chris Cavitt, Mark Cohen

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

Cores, Cache, Content, and Characterization: IBM's Second Generation 14-nm Product, z15.

David Wolpert, Christopher J. Berry, Brian Bell, Adam Jatkowski, Jesse Surprise, John Isakson, Ofer Geva, Brian Deskin, Mark Cichanowski, Dina Hamid, Chris Cavitt, Gregory Fredeman, Dinesh Kannambadi, Anthony Saporito, Ashutosh Mishra, Alper Buyuktosunoglu, Tobias Webel, Preetham Lobo, Ramon Bertran, Pradeep Bhadravati Parashurama, Dureseti Chidambarrao, Brandon Bruen, Alan P. Wagstaff, Eric Lukes, Sean M. Carey, Hunter F. Shi, Michael Romain, Paul Logsdon, Ishita Agarwal

IEEE J. Solid State Circuits, 2021

2020

IBM z15: Physical design improvements to significantly increase content in the same technology.

Christopher J. Berry, David Wolpert, Brian Bell, Adam Jatkowski, Jesse Surprise, Gerald Strevig, John Isakson, Ofer Geva, Brian Deskin, Mark Cichanowski, Giora Biran, Dina Hamid, Chris Cavitt, Gregory Fredeman, Dureseti Chidambarrao, Brandon Bruen, Michael H. Wood, Sean M. Carey, Drew Turner, Leon J. Sigal

IBM J. Res. Dev., 2020

2.7 IBM z15: A 12-Core 5.2GHz Microprocessor.

Christopher J. Berry, Brian Bell, Adam Jatkowski, Jesse Surprise, John Isakson, Ofer Geva, Brian Deskin, Mark Cichanowski, Dina Hamid, Chris Cavitt, Gregory Fredeman, Anthony Saporito, Ashutosh Mishra, Alper Buyuktosunoglu, Tobias Webel, Preetham Lobo, Pradeep Parashurama, Ramon Bertran, Dureseti Chidambarrao, David Wolpert, Brandon Bruen

Proceedings of the 2020 IEEE International Solid- State Circuits Conference, 2020

2018

IBM z14™: 14nm microprocessor for the next-generation mainframe.

Christopher J. Berry, James D. Warnock, John Isakson, John Badar, Brian Bell, Frank Malgioglio, Guenter Mayer, Dina Hamid, Jesse Surprise, David Wolpert, Ofer Geva, Bill Huott, Leon J. Sigal, Sean M. Carey, Richard F. Rizzolo, Ricardo Nigaglioni, Mark Cichanowski, Dureseti Chidambarrao, Christian Jacobi, Anthony Saporito, Arthur O'neill, Robert J. Sonnelitter, Christian G. Zoellin, Michael H. Wood, José Neves

Proceedings of the 2018 IEEE International Solid-State Circuits Conference, 2018

2015

4.1 22nm Next-generation IBM System z microprocessor.

James D. Warnock, Brian W. Curran, John Badar, Gregory Fredeman, Donald W. Plass, Yuen H. Chan, Sean M. Carey, Gerard Salem, Friedrich Schroeder, Frank Malgioglio, Guenter Mayer, Christopher J. Berry, Michael H. Wood, Yiu-Hing Chan, Mark D. Mayo, John Isakson, Charudhattan Nagarajan, Tobias Werner, Leon J. Sigal, Ricardo Nigaglioni, Mark Cichanowski, Jeffrey A. Zitz, Matthew M. Ziegler, Tim Bronson, Gerald Strevig, Daniel Dreps, Ruchir Puri, Douglas Malone, Dieter F. Wendel, Pak-kin Mak, Michael A. Blake

Proceedings of the 2015 IEEE International Solid-State Circuits Conference, 2015