Michael J. Becht

According to our database, Michael J. Becht authored at least 6 papers between 2004 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

IBM Telum II Microprocessor: 5.5 GHz With On-Die AI and Data Processing, and Design-Technology Co-Optimizations for Power, Area, and Reliability.

Gerald Strevig, David Wolpert, Leon Sigal, Bill Huott, Mark Cichanowski, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Matthias Pflanz, Daniel Kiss, Simon Büchsenstein, Tobias Werner, Philipp Salz, Michael Romain, Richard E. Serton, Nick Jing, Rajesh Veerabhadraiah, Dureseti Chidambarrao, Robert Arelt, Matt Angyal, Ben Trombley, Arvind Haran, Rahul M. Rao, Christopher J. Berry, Amanda Venton, Elazar Kachir, Andreas Arp

IEEE J. Solid State Circuits, January, 2026

2025

The IBM Telum II Processor.

Christopher J. Berry, Michael J. Becht, Tim E. Bubb, Howard Haynie, Robert J. Sonnelitter, Katie Seggerman, Jonathan Hsieh, Edward Malley, Mike Cadigan, Susan M. Eickhoff, Matthias Klein, Craig R. Walters, Christian G. Zoellin, Cédric Lichtenau

IEEE Micro, 2025

2.2 IBM Telum II: Next Generation 5.5GHz Microprocessor with On-Die Data Processing Unit and Improved AI Accelerator.

Gerald Strevig, Christopher J. Berry, Rahul M. Rao, Noam Jungmann, Michael A. Sperling, Michael J. Becht, Eduard Herkel, Matthias Pflanz, Patrick J. Meaney, Michael Romain, Mark Cichanowski, Amanda Venton, David Wolpert, Elazar Kachir, Luke Hopkins, Tim E. Bubb, Andreas Arp, Daniel Kiss, Simon Büchsenstein, Michael H. Wood, Michael Spear, Robert J. Sonnelitter, Rajiv Joshi

Proceedings of the IEEE International Solid-State Circuits Conference, 2025

2018

IBM z14: Advancing the I/O storage and networking channel adapter.

Michael J. Becht, Steven G. Aden, Tim E. Bubb, Chris Colonna, Raymond Higgs, Luke Hopkins, Aaron Li, Mushfiq Saleheen, Jose F. Silverio, Raymond Wong, Mooheng Zee

IBM J. Res. Dev., 2018

2007

Redundant I/O interconnect.

Ulrich Helmich, Michael Becht, Michael J. Becht, Janet R. Easton, Richard K. Errickson, Tobias Gehrmann, Steven G. Glassen, Seth R. Greenspan, Frank Koeble, Helge Lehmann, Carl Mayer, Jonathan S. Nikfarjam, Forrest A. Schumacher, Willi Storz

IBM J. Res. Dev., 2007

2004

The structure of chips and links comprising the IBM eServer z990 I/O subsystem.

Edward W. Chencinski, Michael J. Becht, Tim E. Bubb, Carolynn G. Burwick, Juergen Haess, Markus M. Helms, Joseph M. Hoke, Thomas Schlipf, Jeffrey M. Turner, Hartmut Ulland, Manfred H. Walz, Carl H. Whitehead, Gerhard Zilles

IBM J. Res. Dev., 2004