Bert Verlinden

According to our database, Bert Verlinden authored at least 3 papers between 2008 and 2012.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2012

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2012

2010

Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.

Y. Yang, Riet Labie, F. Ling, C. Zhao, A. Radisic, Jan Van Olmen, Youssef Travaly, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2010

2008

Detection of failure sites by focused ion beam and nano-probing in the interconnect of three-dimensional stacked circuit structures.

Yu Yang, Hugo Bender, Kai Arstila, Bart Swinnen, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2008