Kris Vanstreels

According to our database, Kris Vanstreels authored at least 8 papers between 2004 and 2015.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2015

Impact of oxide liner properties on TSV Cu pumping and TSV stress.

Joke De Messemaeker, O. Varela Pedreira, A. Moussa, Nabi Nabiollahi, Kris Vanstreels, Stefaan Van Huylenbroeck, Harold Philipsen, Patrick Verdonck, Bart Vandevelde, Ingrid De Wolf, Eric Beyne, Kris Croes

Proceedings of the IEEE International Reliability Physics Symposium, 2015

2014

Soft, Comfortable Polymer Dry Electrodes for High Quality ECG and EEG Recording.

Yun-Hsuan Chen, Maaike Op de Beeck, Luc Vanderheyden, Evelien Carrette, Vojkan Mihajlovic, Kris Vanstreels, Bernard Grundlehner, Stefanie Gadeyne, Paul Boon, Chris Van Hoof

Sensors, 2014

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling.

Bart Vandevelde, Andrej Ivankovic, B. Debecker, Melina Lofrano, Kris Vanstreels, Wei Guo, Vladimir Cherman, Marcel Gonzalez, Geert Van der Plas, Ingrid De Wolf, Eric Beyne, Zsolt Tokei

Microelectron. Reliab., 2014

2012

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.

Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde

Microelectron. Reliab., 2012

Diffusion growth of Cu₃Sn phase in the bump and thin film Cu/Sn structures.

Biljana Dimcic, Riet Labie, Joke De Messemaeker, Kris Vanstreels, Kris Croes, Bert Verlinden, Ingrid De Wolf

Microelectron. Reliab., 2012

2011

Cu pumping in TSVs: Effect of pre-CMP thermal budget.

Ingrid De Wolf, Kris Croes, O. Varela Pedreira, Riet Labie, Augusto Redolfi, M. Van De Peer, Kris Vanstreels, C. Okoro, Bart Vandevelde, Eric Beyne

Microelectron. Reliab., 2011

2005

A new method for the lifetime determination of submicron metal interconnects by means of a parallel test structure.

Kris Vanstreels, Marc D'Olieslaeger, Ward De Ceuninck, Jan D'Haen, Karen Maex

Microelectron. Reliab., 2005

2004

MTF test system with AC based dynamic joule correction for electromigration tests on interconnects.

Leen Biesemans, K. Schepers, Kris Vanstreels, Jan D'Haen, Ward De Ceuninck, Marc D'Olieslaeger

Microelectron. Reliab., 2004