Jan Van Olmen

According to our database1, Jan Van Olmen authored at least 6 papers between 2009 and 2017.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2017
Thin-Film Quantum Dot Photodiode for Monolithic Infrared Image Sensors.
Sensors, 2017

2011
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

2010
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.
Microelectron. Reliab., 2010


2009
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV).
Proceedings of the IEEE International Conference on 3D System Integration, 2009



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