Riet Labie

According to our database1, Riet Labie authored at least 6 papers between 2010 and 2017.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

Legend:

Book 
In proceedings 
Article 
PhD thesis 
Other 

Links

On csauthors.net:

Bibliography

2017
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components.
Microelectron. Reliab., 2017

2012
Diffusion growth of Cu<sub>3</sub>Sn phase in the bump and thin film Cu/Sn structures.
Microelectron. Reliab., 2012

2011
Cu pumping in TSVs: Effect of pre-CMP thermal budget.
Microelectron. Reliab., 2011

Design Issues and Considerations for Low-Cost 3-D TSV IC Technology.
IEEE J. Solid State Circuits, 2011

2010
Processing assessment and adhesion evaluation of copper through-silicon vias (TSVs) for three-dimensional stacked-integrated circuit (3D-SIC) architectures.
Microelectron. Reliab., 2010



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