Chao-Kai Hsu

According to our database, Chao-Kai Hsu authored at least 3 papers between 2013 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Miniaturized and Cost-Effective Programmable 2.5D/3.5D Platforms Enabled by Scalable Embedded Active Bridge Chipset.

Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Ching-Iang Li, Yung-Sheng Chang, Ming-Ji Dai, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang

IEEE J. Emerg. Sel. Topics Circuits Syst., September, 2025

2024

Scalable Embedded Multi-Die Active Bridge (S-EMAB) Chips with Integrated LDOs for Low-Cost Programmable 2.5D/3.5D Packaging Technology.

Wei Lu, Jie Zhang, Yi-Hui Wei, Hsu-Ming Hsiao, Sih-Han Li, Chao-Kai Hsu, Chih-Cheng Hsiao, Feng-Hsiang Lo, Shyh-Shyuan Sheu, Chin-Hung Wang, Wei-Chung Lo, Shih-Chieh Chang, Hung-Ming Chen, Kuan-Neng Chen, Po-Tsang Huang

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2013

Performance and process characteristic of glass interposer with through-glass-via(TGV).

Chun-Hsien Chien, Hsun Yu, Ching-Kuan Lee, Yu-Min Lin, Ren-Shin Cheng, Chau-Jie Zhan, Peng-Shu Chen, Chang-Chih Liu, Chao-Kai Hsu, Hsiang-Hung Chang, Huan-Chun Fu, Yuan-Chang Lee, Wen-Wei Shen, Cheng-Ta Ko, Wei-Chung Lo, Yung Jean Lu

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013