Clément Castan

According to our database, Clément Castan authored at least 3 papers between 2019 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2025

Compact MEOL OxRAM with 14 Conductance Levels for Dense Embedded Inference Computing.

Joel Minguet Lopez, Sylvain Barraud, Manon Dampfhoffer, Aurelie Souhaité, Theophile Dubreuil, Jean-Michel Pedini, Corinne Comboroure, Ahmed Gharbi, François Boulard, Clément Castan, Amélie Lambert, François Andrieu

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2019

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.

Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019