Frank Fournel

According to our database, Frank Fournel authored at least 7 papers between 2012 and 2022.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2022

Engineered SiC materials for power technologies.

Walter Schwarzenbach, S. Rouchier, G. Berre, R. Boulet, O. Ledoux, Enrica Cela, Alexis Drouin, A. Chapelle, S. Monnoye, H. Biard, K. Alassaad, L. Viravaux, N. Ben Mohamed, D. Radisson, G. Picun, G. Lavaitte, A. Bouville-Lallart, J. Roi, J. Widiez, K. Abadie, E. Rolland, Frank Fournel, G. Gélineau, F. Mazen, A. Moulin, C. Moulin, D. Delprat, N. Daval, S. Odoul, P. Sandri, Christophe Maleville

Proceedings of the International Conference on IC Design and Technology, 2022

2021

AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs.

Claire Besancon, Delphine Néel, Joan Ramirez, David Bitauld, Giancarlo Cerulo, Dalila Make, Nicolas Vaissiere, Frédéric Pommereau, Frank Fournel, Loic Sanchez, Cécilia Dupré, Viviane Muffato, Karim Hassan, Jean Decobert

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

2020

Laser Array Covering 155 nm Wide Spectral Band Achieved by Selective Area Growth on Silicon Wafer.

C. Besancon, Pierre Fanneau, Delphine Néel, Giancarlo Cerulo, Nicolas Vaissiere, Dalila Make, Frédéric Pommereau, Frank Fournel, Cécilia Dupré, T. Baron, Jean Decobert

Proceedings of the European Conference on Optical Communications, 2020

2019

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.

Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.

Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, Frank Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2012

Low temperature direct bonding: An attractive technique for heterostructures build-up.

H. Moriceau, F. Rieutord, Frank Fournel, Léa Di Cioccio, C. Moulet, Luc Libralesso, Pierric Gueguen, Rachid Taibi, C. Deguet

Microelectron. Reliab., 2012