Loïc Sanchez

According to our database, Loïc Sanchez authored at least 8 papers between 2011 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

AlGaInAs MQW Laser Regrowth on Heterogenerous InP-on-SOI: Performance for Different Silicon Cavity Designs.

Claire Besancon, Delphine Néel, Joan Ramirez, David Bitauld, Giancarlo Cerulo, Dalila Make, Nicolas Vaissiere, Frédéric Pommereau, Frank Fournel, Loic Sanchez, Cécilia Dupré, Viviane Muffato, Karim Hassan, Jean Decobert

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2021

2019

Die to Wafer Direct Hybid Bonding Demonstration with High Alignment Accuracy and Electrical Yields.

Amadine Jouve, Loïc Sanchez, Clément Castan, Nicolas Bresson, Frank Fournel, Nicolas Raynaud, Pascal Metzger

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.

Emilie Bourjot, Paul Stewart, Christophe Dubarry, E. Lagoutte, E. Rolland, Nicolas Bresson, G. Romano, D. Scevola, Viorel Balan, Jérôme Dechamp, Marc Zussy, Gaëlle Mauguen, Clément Castan, Loïc Sanchez, Amadine Jouve, Frank Fournel, Séverine Cheramy

Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018

High-Speed Heterogeneous InP-on-Si Capacitive Phase Modulators.

Sylvie Menezo, Torrey Thiessen, Philippe Grosse, Joyce K. S. Poon, Christophe Jany, Jeremy Da Fonseca, Bertrand Szelag, Benoît Charbonnier, Georgio El-Zammar, Olivier Lemonnier, Patricia Bilondeau, Stephane Malhouitre, Brigitte Montmayeul, Loic Sanchez

Proceedings of the Optical Fiber Communications Conference and Exposition, 2018

2015

Heterogeneously integrated III-V on silicon distributed feedback lasers at 1310 nm.

Helene Duprez, Antoine Descos, Thomas Ferrotti, Julie Harduin, Christophe Jany, T. Card, A. Myko, Loic Sanchez, Corrado Sciancalepore, Sylvie Menezo, Badhise Ben Bakir

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2015

2013

Chip to wafer copper direct bonding electrical characterization and thermal cycling.

Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2011

3D monolithic integration.

Perrine Batude, Maud Vinet, Arnaud Pouydebasque, Cyrille Le Royer, Bernard Previtali, Claude Tabone, Jean-Michel Hartmann, Loic Sanchez, Laurence Baud, Veronique Carron, Alain Toffoli, Fabienne Allain, Vincent Mazzocchi, Dominique Lafond, Simon Deleonibus, Olivier Faynot

Proceedings of the International Symposium on Circuits and Systems (ISCAS 2011), 2011

Impact of containment and deposition method on sub-micron chip-to-wafer self-assembly yield.

Sebastien Mermoz, Loic Sanchez, Léa Di Cioccio, Jean Berthier, Emilie Deloffre, Christian Fretigny

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011