Marc Zussy

According to our database1, Marc Zussy authored at least 3 papers between 2009 and 2019.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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PhD thesis 
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Links

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Bibliography

2019
Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2009
First integration of Cu TSV using die-to-wafer direct bonding and planarization.
Proceedings of the IEEE International Conference on 3D System Integration, 2009

An innovative die to wafer 3D integration scheme: Die to wafer oxide or copper direct bonding with planarised oxide inter-die filling.
Proceedings of the IEEE International Conference on 3D System Integration, 2009


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