Daniel Vanderstraeten

According to our database, Daniel Vanderstraeten authored at least 5 papers between 2004 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2020

Effect of Residual TiN on Reliability of Au Wire Bonds during High Temperature Storage.

John M. McGlone, Guy Brizar, Daniel Vanderstraeten, Dorai Iyer, Sallie Hose, Jeff P. Gambino

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2013

Impact of the leadframe profile on the occurrence of passivation cracks of plastic-encapsulated electronic power devices.

Jan Ackaert, Aditi Malik, Daniel Vanderstraeten

Proceedings of 2013 International Conference on IC Design & Technology, 2013

2012

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging.

Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde

Microelectron. Reliab., 2012

2010

Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation.

Sergey Bychikhin, Georg Haberfehlner, J. Rhayem, Daniel Vanderstraeten, Renaud Gillon, Dionyz Pogany

Microelectron. Reliab., 2010

2004

Sub-pixel image correlation: an alternative to SAM and dye penetrant for crack detection and mechanical stress localisation in semiconductor packages.

Jason Y. L. Goh, Mark C. Pitter, Chung W. See, Michael G. Somekh, Daniel Vanderstraeten

Microelectron. Reliab., 2004