Erik Jung

According to our database, Erik Jung authored at least 9 papers between 2007 and 2019.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2019

Design and Selection of Muscle Excitation Patterns for Modeling a Lower Extremity Joint Inspired Tensegrity.

Erik Jung, Victoria Ly, Adam Buderi, Emma Appleton, Mircea Teodorescu

Proceedings of the 3rd IEEE International Conference on Robotic Computing, 2019

2018

Bio-Inspired Tensegrity Flexural Joints.

Erik Jung, Victoria Ly, Nicholas Cessna, Mai Linh Ngo, Dennis Castro, Vytas SunSpiral, Mircea Teodorescu

Proceedings of the 2018 IEEE International Conference on Robotics and Automation, 2018

2016

A lightweight, multi-axis compliant tensegrity joint.

Steven Lessard, Jonathan Bruce, Erik Jung, Mircea Teodorescu, Vytas SunSpiral, Adrian K. Agogino

Proceedings of the 2016 IEEE International Conference on Robotics and Automation, 2016

2015

A light-weight, multi-axis compliant tensegrity joint.

Steven Lessard, Jonathan Bruce, Erik Jung, Mircea Teodorescu, Vytas SunSpiral, Adrian K. Agogino

CoRR, 2015

2008

3-D Capacitive Interconnections With Mono- and Bi-Directional Capabilities.

Alberto Fazzi, Roberto Canegallo, Luca Ciccarelli, Luca Magagni, Federico Natali, Erik Jung, Pier Luigi Rolandi, Roberto Guerrieri

IEEE J. Solid State Circuits, 2008

Lamination And Microstructuring Technology for a Bio-Cell Multiwell array

Erik Jung, Dionysios Manessis, Alexander Neumann, Lars Böttcher, Tanja Braun, Jörg Bauer, Herbert Reichl, Bruno Iafelice, Federica Destro, Roberto Gambari

CoRR, 2008

2007

3-D Capacitive Interconnections for Wafer-Level and Die-Level Assembly.

Alberto Fazzi, Luca Magagni, Mauro Mirandola, Barbara Charlet, Léa Di Cioccio, Erik Jung, Roberto Canegallo, Roberto Guerrieri

IEEE J. Solid State Circuits, 2007

3D Capacitive Interconnections with Mono- and Bi-Directional Capabilities.

Alberto Fazzi, Roberto Canegallo, Luca Ciccarelli, Luca Magagni, Federico Natali, Erik Jung, Pier Luigi Rolandi, Roberto Guerrieri

Proceedings of the 2007 IEEE International Solid-State Circuits Conference, 2007

3D Capacitive Interconnections for High Speed Interchip Communication.

Roberto Canegallo, Alberto Fazzi, Luca Ciccarelli, Luca Magagni, Federico Natali, Pier Luigi Rolandi, Erik Jung, Léa Di Cioccio, Roberto Guerrieri

Proceedings of the IEEE 2007 Custom Integrated Circuits Conference, 2007