Hiroo Masuda

According to our database1, Hiroo Masuda authored at least 31 papers between 1985 and 2010.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Bibliography

2010
A New LDMOS Transistor Macro-Modeling for Accurately Predicting Bias Dependence of Gate-Overlap Capacitance.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2010

Impact of Self-Heating in Wire Interconnection on Timing.
IEICE Trans. Electron., 2010

2009
An Approach for Reducing Leakage Current Variation due to Manufacturing Variability.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009

Improvement in Computational Accuracy of Output Transition Time Variation Considering Threshold Voltage Variations.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009

Comprehensive Matching Characterization of Analog CMOS Circuits.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2009

2008
A Novel Expression of Spatial Correlation by a Random Curved Surface Model and Its Application to LSI Design.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2008

Concise Modeling of Transistor Variations in an LSI Chip and Its Application to SRAM Cell Sensitivity Analysis.
IEICE Trans. Electron., 2008

2006
Determination of Interconnect Structural Parameters for Best- and Worst-Case Delays.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006

Formula-Based Method for Capacitance Extraction of Interconnects with Dummy Fills.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2006

2005
A Practical Approach for Efficiently Extracting Interconnect Capacitances with Floating Dummy Fills.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005

Efficient Dummy Filling Methods to Reduce Interconnect Capacitance and Number of Dummy Metal Fills.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005

Second-Order Polynomial Expressions for On-Chip Interconnect Capacitance.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2005

Design Guidelines and Process Quality Improvement for Treatment of Device Variations in an Lsi Chip.
IEICE Trans. Electron., 2005

Capacitance and Yield Evaluations Using a 90-nm Process Technology Based on the Dense Power-Ground Interconnect Architecture.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005

Dummy Filling Methods for Reducing Interconnect Capacitance and Number of Fills.
Proceedings of the 6th International Symposium on Quality of Electronic Design (ISQED 2005), 2005

Approach for physical design in sub-100 nm era.
Proceedings of the International Symposium on Circuits and Systems (ISCAS 2005), 2005

Challenge: variability characterization and modeling for 65- to 90-nm processes.
Proceedings of the IEEE 2005 Custom Integrated Circuits Conference, 2005

2004
Efficient capacitance extraction method for interconnects with dummy fills.
Proceedings of the IEEE 2004 Custom Integrated Circuits Conference, 2004

Large-scale linear circuit simulation with an inversed inductance matrix.
Proceedings of the 2004 Conference on Asia South Pacific Design Automation: Electronic Design and Solution Fair 2004, 2004

DEPOGIT: dense power-ground interconnect architecture for physical design integrity.
Proceedings of the 2004 Conference on Asia South Pacific Design Automation: Electronic Design and Solution Fair 2004, 2004

2003
Crosstalk delay analysis of a 0.13-μm node test chip and precise gate-level simulation technology.
IEEE J. Solid State Circuits, 2003

Approximation Formula Approach for the Efficient Extraction of On-Chip Mutual Inductances.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2003

Fast On-Chip Inductance Extraction of VLSI Including Angled Interconnects.
IEICE Trans. Fundam. Electron. Commun. Comput. Sci., 2003

Design and Measurement of an Inductance-Oscillator for Analyzing Inductance Impact on On-Chip Interconnect Delay.
Proceedings of the 4th International Symposium on Quality of Electronic Design (ISQED 2003), 2003

Approximate formulae approach for efficient inductance extraction.
Proceedings of the 2003 Asia and South Pacific Design Automation Conference, 2003

1998
TCAD/DA for MPU and ASIC Development.
Proceedings of the ASP-DAC '98, 1998

1991
A submicrometer MOS transistor I-V model for circuit simulation.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1991

1988
MOSTSM: a physically based charge conservative MOSFET model.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1988

1987
A Two-Dimensional Integrated Process Simulator: SPIRIT-I.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1987

A New Design-Centering Methodology for VLSI Device Development.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1987

1985
Three-Dimensional Device Simulator CADDETH with Highly Convergent Matrix Solution Algorithms.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst., 1985


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