Jingyan Fu

Orcid: 0000-0003-3017-4848

According to our database1, Jingyan Fu authored at least 15 papers between 2015 and 2022.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

On csauthors.net:

Bibliography

2022
Reliability Improvement in RRAM-based DNN for Edge Computing.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2022

2021
Ameliorate Performance of Memristor-Based ANNs in Edge Computing.
IEEE Trans. Computers, 2021

Memristor-Based Variation-Enabled Differentially Private Learning Systems for Edge Computing in IoT.
IEEE Internet Things J., 2021

Improving DNN Fault Tolerance using Weight Pruning and Differential Crossbar Mapping for ReRAM-based Edge AI.
Proceedings of the 22nd International Symposium on Quality Electronic Design, 2021

TinyADC: Peripheral Circuit-aware Weight Pruning Framework for Mixed-signal DNN Accelerators.
Proceedings of the Design, Automation & Test in Europe Conference & Exhibition, 2021

2020
Cycle-to-cycle Variation Enabled Energy Efficient Privacy Preserving Technology in ANN.
Proceedings of the 33rd IEEE International System-on-Chip Conference, 2020

2019
Memristor-Based Neuromorphic Hardware Improvement for Privacy-Preserving ANN.
IEEE Trans. Very Large Scale Integr. Syst., 2019

Mitigating Nonlinear Effect of Memristive Synaptic Device for Neuromorphic Computing.
IEEE J. Emerg. Sel. Topics Circuits Syst., 2019

Linear Optimization for Memristive Device in Neuromorphic Hardware.
Proceedings of the 2019 IEEE Computer Society Annual Symposium on VLSI, 2019

2018
A Novel Hybrid Delay Unit Based on Dummy TSVs for 3-D On-Chip Memory.
IEEE Trans. Very Large Scale Integr. Syst., 2018

Time-varying algorithm for swarm robotics.
IEEE CAA J. Autom. Sinica, 2018

2017
On-chip thermal management method based on phase change material.
Proceedings of the IEEE 60th International Midwest Symposium on Circuits and Systems, 2017

2015
A novel thermal-aware structure of TSV cluster.
Proceedings of the 28th IEEE International System-on-Chip Conference, 2015

A TSV alignment design for multilayer 3D IC.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015

A thermal-aware distribution method of TSV in 3D IC.
Proceedings of the 2015 IEEE 11th International Conference on ASIC, 2015


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