John H. Lau

According to our database, John H. Lau authored at least 5 papers between 2008 and 2013.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2013

Challenges of Cu CMP of TSVs and RDLs fabricated from the backside of a thin wafer.

Jui-Chin Chen, John H. Lau, Tzu-Chien Hsu, Chien-Chou Chen, Pei-Jer Tzeng, Po-Chih Chang, Chun-Hsien Chien, Yiu-Hsiang Chang, Shang-Chun Chen, Yu-Chen Hsin, Sue-Chen Liao, Cha-Hsin Lin, Tzu-Kun Ku, Ming-Jer Kao

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Effects of TSVs (through-silicon vias) on thermal performances of 3D IC integration system-in-package (SiP).

John H. Lau, Tang Gong Yue

Microelectron. Reliab., 2012

2011

Recent advances and new trends in nanotechnology and 3D integration for semiconductor industry.

John H. Lau

Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010

Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package.

Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn

Microelectron. Reliab., 2010

2008

Design and analysis of bi-directional pumping silicon Raman laser.

Ying Huang, Ming Tang, Ping Shum, Jing Zhang, John H. Lau

Proceedings of the 2008 International Conference on Advanced Infocomm Technology, 2008