Andy Miller

According to our database1, Andy Miller authored at least 15 papers between 1999 and 2024.

Collaborative distances:
  • Dijkstra number2 of four.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2024
Low-loss, multi-reticle stitched SiN waveguides for 300mm wafer-level optical interconnects.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

Collective die-to-wafer bonding enabling low-loss evanescent coupling for optically interconnected System-on-Wafer.
Proceedings of the Optical Fiber Communications Conference and Exhibition, 2024

2019
Process Complexity and Cost Considerations of Multi-Layer Die Stacks.
Proceedings of the 2019 International 3D Systems Integration Conference (3DIC), 2019

2018
Packaging and Assembly Challenges for 50G Silicon Photonics Interposers.
Proceedings of the Optical Fiber Communications Conference and Exposition, 2018


2016
Importance of alignment control during permanent bonding and its impact on via-last alignment for high density 3D interconnects.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Extreme wafer thinning optimization for via-last applications.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

Die to wafer 3D stacking for below 10um pitch microbumps.
Proceedings of the 2016 IEEE International 3D Systems Integration Conference, 2016

2015
Processing active devices on Si interposer and impact on cost.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics.
Proceedings of the 2015 International 3D Systems Integration Conference, 2015

2013
Trees of integral triangles with given rectangular defect.
Discret. Math., 2013

2011
Ultrathin wafer handling in 3D Stacked IC manufacturing combining a novel ZoneBOND™ temporary bonding process with room temperature peel debonding.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

In-line metrology and inspection for process control during 3D stacking of IC's.
Proceedings of the 2011 IEEE International 3D Systems Integration Conference (3DIC), Osaka, Japan, January 31, 2011

2010
Counting numerical sets with no small atoms.
J. Comb. Theory A, 2010

1999
Generating Functions for Actions on Handlebodies with Genus Zero Quotient.
J. Comb. Theory A, 1999


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