Leon Chou

According to our database, Leon Chou authored at least 6 papers between 2019 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

WGrid: Wafermap Grid Pattern Recognition with Machine Learning Techniques.

Peter Yi-Yu Liao, Katherine Shu-Min Li, Leon Li-Yang Chen, Sying-Jyan Wang, Andrew Yi-Ann Huang, Ken Chau-Cheung Cheng, Nova Cheng-Yen Tsai, Leon Chou

Proceedings of the IEEE International Test Conference, 2021

Automatic Inspection for Wafer Defect Pattern Recognition with Unsupervised Clustering.

Katherine Shu-Min Li, Leon Li-Yang Chen, Ken Chau-Cheung Cheng, Peter Yi-Yu Liao, Sying-Jyan Wang, Andrew Yi-Ann Huang, Nova Cheng-Yen Tsai, Leon Chou, Gus Chang-Hung Han, Jwu E. Chen, Hsing-Chung Liang, Chun-Lung Hsu

Proceedings of the 26th IEEE European Test Symposium, 2021

2020

TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning.

Leon Li-Yang Chen, Katherine Shu-Min Li, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Andrew Yi-Ann Huang, Leon Chou, Nova Cheng-Yen Tsai, Chen-Shiun Lee

Proceedings of the IEEE International Test Conference, 2020

PWS: Potential Wafermap Scratch Defect Pattern Recognition with Machine Learning Techniques.

Katherine Shu-Min Li, Peter Yi-Yu Liao, Leon Chou, Ken Chau-Cheung Cheng, Andrew Yi-Ann Huang, Sying-Jyan Wang, Gus Chang-Hung Han

Proceedings of the IEEE European Test Symposium, 2020

Wafer-Level Test Path Pattern Recognition and Test Characteristics for Test-Induced Defect Diagnosis.

Ken Chau-Cheung Cheng, Katherine Shu-Min Li, Andrew Yi-Ann Huang, Ji-Wei Li, Leon Li-Yang Chen, Nova Cheng-Yen Tsai, Sying-Jyan Wang, Chen-Shiun Lee, Leon Chou, Peter Yi-Yu Liao, Hsing-Chung Liang, Jwu E. Chen

Proceedings of the 2020 Design, Automation & Test in Europe Conference & Exhibition, 2020

2019

TestDNA: Novel Wafer Defect Signature for Diagnosis and Yield Learning.

Andrew Yi-Ann Huang, Katherine Shu-Min Li, Cheng-Yen Tsai, Ken Chau-Cheung Cheng, Sying-Jyan Wang, Xu-Hao Jiang, Leon Chou, Chen-Shiun Lee

Proceedings of the IEEE International Test Conference, 2019