Michael Zervas

According to our database, Michael Zervas authored at least 8 papers between 2011 and 2023.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2023

Heterogeneous balanced photodetector on silicon nitride with 30 GHz bandwidth and 26 dB common mode rejection ratio.

Junyi Gao, Ta Ching Tzu, Tasneem Fatema, Xiangwen Guo, Qianhuan Yu, Gabriele Navickaite, Michael Zervas, Michael Geiselmann, Andreas Beling

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2023

2022

Hybrid InP-SiN microring-resonator based tunable laser with high output power and narrow linewidth for high capacity coherent systems.

Cosimo Calò, Kaoutar Benyahya, Haïk Mardoyan, Philippe Charbonnier, Davide Sacchetto, Michael Zervas, Karim Mekhazni, Delphine Lanteri, Harry Gariah, Catherine Fortin, Nicolas Vaissière, Antoine Elias, Olivier Parillaud, Franck Mallecot, Jean Decobert, Frédéric Pommereau, Jérémie Renaudier

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2022

2020

Heterogeneous Photodiodes on Silicon Nitride Waveguides with 20 GHz Bandwidth.

Qianhuan Yu, Junyi Gao, Nan Ye, Boheng Chen, Keye Sun, Linli Xie, Kartik Srinivasan, Michael Zervas, Gabriele Navickaite, Michael Geiselmann, Andreas Beling

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2020

2019

Ultralow-Power Chip-Based Soliton Microcombs for Photonic Integration.

Junqiu Liu, Arslan S. Raja, Maxim Karpov, Bahareh Ghadiani, Martin H. P. Pfeiffer, Anton Lukashchuk, Nils J. Engelsen, Hairun Guo, Michael Zervas, Tobias J. Kippenberg

Proceedings of the Optical Fiber Communications Conference and Exhibition, 2019

2018

Ultra-Low-Power Photonic Chip-Based Soliton Frequency Combs.

Junqiu Liu, Arslan S. Raja, Maxim Karpov, Hairun Guo, Martin H. P. Pfeiffer, Bahareh Ghadiani, Michael Zervas, Tobias J. Kippenberg

Proceedings of the European Conference on Optical Communication, 2018

2013

Integration of intra chip stack fluidic cooling using thin-layer solder bonding.

Yassir Madhour, Michael Zervas, Gerd Schlottig, Thomas Brunschwiler, Yusuf Leblebici, John Richard Thome, Bruno Michel

Proceedings of the 2013 IEEE International 3D Systems Integration Conference (3DIC), 2013

2012

Design and Testing Strategies for Modular 3-D-Multiprocessor Systems Using Die-Level Through Silicon Via Technology.

Giulia Beanato, Paolo Giovannini, Alessandro Cevrero, Panagiotis Athanasopoulos, Michael Zervas, Yuksel Temiz, Yusuf Leblebici

IEEE J. Emerg. Sel. Topics Circuits Syst., 2012

2011

Real-time MRI-guided needle placement robot with integrated fiber optic force sensing.

Hao Su, Michael Zervas, Gregory A. Cole, Cosme Furlong, Gregory S. Fischer

Proceedings of the IEEE International Conference on Robotics and Automation, 2011