Miji Lee

According to our database, Miji Lee authored at least 7 papers between 2015 and 2020.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2020

Reliability on EUV Interconnect Technology for 7nm and beyond.

Tae-Young Jeong, Miji Lee, Yunkyung Jo, Jinwoo Kim, Min Kim, Myungsoo Yeo, Jinseok Kim, Hyunjun Choi, Joosung Kim, Yoojin Jo, Yongsung Ji, Taiki Uemura, Hai Jiang, Dongkyun Kwon, HwaSung Rhee, Sangwoo Pae, Brandon Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

A Study on Linguistic Management in Online and Offline Communities: Focusing on the Effect of Jargons on the Conflict.

U. Jin Baek, Miji Lee, Jongtae Lee

Int. J. Asian Bus. Inf. Manag., 2019

2018

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.

Younggeun Ji, Jeonghoon Kim, Jungin Kim, Miji Lee, Jaeheon Noh, Taeyoung Jeong, Juhyeon Shin, Junho Kim, Young Heo, Ung Cho, Hyun-Chul Sagong, Junekyun Park, Yeonsik Choo, Gilhwan Do, Hoyoung Kang, Eunkyeong Choi, Dongyoon Sun, Changki Kang, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2018

2017

Machine learning-based anomaly detection via integration of manufacturing, inspection and after-sales service data.

Taehoon Ko, Je Hyuk Lee, Hyunchang Cho, Sungzoon Cho, Wounjoo Lee, Miji Lee

Ind. Manag. Data Syst., 2017

2015

Reliability of fine pitch COF: Influence of surface morphology and CuSn intermetallic compound formation.

Jongwoo Park, Miji Lee, Kyunghwan Min, J.-K. Choi, Changkyu Joo, S.-C. Park, Hanbyul Kang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Effects of front-end-of line process variations and defects on retention failure of flash memory: Charge loss/gain mechanism.

Jongwoo Park, Miji Lee, Hanbyul Kang, Wooram Ko, Eunkyeong Choi, Junsik Im, Minwoo Lee, Dohwan Chung, Jinchul Park, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2015

Contact resistance of solder bump with low cost photosensitive polyimide for high performance SoC.

Jongwoo Park, Jungpyo Hong, Miji Lee, Dongyoon Sun, Kyung Kang, Taesung Kim, Seungwon Kim, Sujin Kwon, Changkyu Joo, Sangsu Ha, Wooyeon Kim, Jongsu Ryu, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2015