Taeyoung Jeong

According to our database, Taeyoung Jeong authored at least 14 papers between 2018 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

CAF-Score: Calibrating CLAP with LALMs for Reference-free Audio Captioning Evaluation.

Insung Lee, Taeyoung Jeong, Haejun Yoo, Du-Seong Chang, Myoung-Wan Koo

CoRR, March, 2026

VacHopPy: A Python package for vacancy hopping analysis based on molecular dynamics simulations.

Taeyoung Jeong, Kun Hee Ye, Seungjae Yoon, Dohyun Kim, Yunjae Kim, Cheol Seong Hwang, Jung-Hae Choi

Comput. Phys. Commun., 2026

2024

An Analysis of CDM-induced BTI-like Degradation using VF-TLP in Advanced FinFET Technology.

Sangmin Oh, Taeyoung Jeong, Junghwan Yum, Minhyuk Lim, Yoohwan Kim, Bongyong Jeong, Jeongmin Jo, Hyewon Shim, Shin-Young Chung, Paul Jung

Proceedings of the IEEE International Reliability Physics Symposium, 2024

2022

In-Depth Analysis of One Selector-One Resistor Crossbar Array for Its Writing and Reading Operations for Hardware Neural Network with Finite Wire Resistance.

Jihun Kim, Hyo Cheon Woo, Taeyoung Jeong, Jung-Hae Choi, Cheol Seong Hwang

Adv. Intell. Syst., 2022

2020

ProcAnalyzer: Effective Code Analyzer for Tuning Imperative Programs in SAP HANA.

Kisung Park, Taeyoung Jeong, Chanho Jeong, Jaeha Lee, Dong-Hun Lee, Young-Koo Lee

Proceedings of the 2020 International Conference on Management of Data, 2020

Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET.

Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Youngin Park, Kiil Hong, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM.

Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.

Heung-Kook Ko, Sena Park, Jihyun Ryu, Sung Ryul Kim, Giwon Lee, Dongjoon Lee, Sangwoo Pae, Euncheol Lee, Yongsun Ji, Hai Jiang, Taeyoung Jeong, Taiki Uemura, Dongkyun Kwon, Hyungrok Do, Hyungu Kahng, Yoon-Sang Cho, Jiyoon Lee, Seoung Bum Kim

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology.

Hai Jiang, Hyun-Chul Sagong, Jinju Kim, Hyewon Shim, Yoohwan Kim, Junekyun Park, Taiki Uemura, Yongsung Ji, Taeyoung Jeong, Dongkyun Kwon, Hwasung Rhee, Sangwoo Pae, Brandon Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability of Industrial grade Embedded-STT-MRAM.

Yongsung Ji, Hyunjae Goo, Jungman Lim, Tae-Young Jeong, Taiki Uemura, Gun Rae Kim, Boil Seo, Seungbae Lee, Goeun Park, Jeongmin Jo, Sang-Il Han, Kilho Lee, Junghyuk Lee, Sohee Hwang, Daesop Lee, Suksoo Pyo, Hyun Taek Jung, Shinhee Han, Seungmo Noh, Kiseok Suh, Sungyoung Yoon, Hyeonwoo Nam, Hyewon Hwang, Hai Jiang, J. W. Kim, D. Kwon, Yoonjong Song, K. H. Koh, Hwasung Rhee, Sangwoo Pae, E. Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability on EUV Interconnect Technology for 7nm and beyond.

Tae-Young Jeong, Miji Lee, Yunkyung Jo, Jinwoo Kim, Min Kim, Myungsoo Yeo, Jinseok Kim, Hyunjun Choi, Joosung Kim, Yoojin Jo, Yongsung Ji, Taiki Uemura, Hai Jiang, Dongkyun Kwon, HwaSung Rhee, Sangwoo Pae, Brandon Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Cyber Attack Scenarios in Cooperative Automated Driving.

Insu Oh, Eunseon Jeong, Junyoung Park, Taeyoung Jeong, Junghoon Park, Kangbin Yim

Proceedings of the Advances on Broad-Band Wireless Computing, Communication and Applications, 2020

2018

Effects of Far-BEOL anneal on the WLR and product reliability characterization of FinFET process technology.

Hyun-Chul Sagong, Hyunjin Kim, Seungjin Choo, Sungyoung Yoon, Hyewon Shim, Sangsu Ha, Tae-Young Jeong, Minhyeok Choe, Junekyun Park, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2018

Reliability characterization of advanced CMOS image sensor (CIS) with 3D stack and in-pixel DTI.

Younggeun Ji, Jeonghoon Kim, Jungin Kim, Miji Lee, Jaeheon Noh, Taeyoung Jeong, Juhyeon Shin, Junho Kim, Young Heo, Ung Cho, Hyun-Chul Sagong, Junekyun Park, Yeonsik Choo, Gilhwan Do, Hoyoung Kang, Eunkyeong Choi, Dongyoon Sun, Changki Kang, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2018