Hai Jiang

According to our database, Hai Jiang authored at least 9 papers between 2019 and 2021.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of four.

2021

Time Dependent Variability in Advanced FinFET Technology for End-of-Lifetime Reliability Prediction.

Hai Jiang, Jinju Kim, Kihyun Choi, Hyewon Shim, Hyunchul Sagong, Junekyun Park, Hwasung Rhee, Euncheol Lee

Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020

Investigating of SER in 28 nm FDSOI-Planar and Comparing with SER in Bulk-FinFET.

Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Youngin Park, Kiil Hong, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Backside Alpha-Irradiation Test in Flip-Chip Package in EUV 7 nm FinFET SRAM.

Taiki Uemura, Byungjin Chung, Jeongmin Jo, Hai Jiang, Yongsung Ji, Tae-Young Jeong, Rakesh Ranjan, Seungbae Lee, Hwasung Rhee, Sangwoo Pae, Euncheol Lee, Jaehee Choi, Shota Ohnishi, Ken Machida

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Early Diagnosis and Prediction of Wafer Quality Using Machine Learning on sub-10nm Logic Technology.

Heung-Kook Ko, Sena Park, Jihyun Ryu, Sung Ryul Kim, Giwon Lee, Dongjoon Lee, Sangwoo Pae, Euncheol Lee, Yongsun Ji, Hai Jiang, Taeyoung Jeong, Taiki Uemura, Dongkyun Kwon, Hyungrok Do, Hyungu Kahng, Yoon-Sang Cho, Jiyoon Lee, Seoung Bum Kim

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology.

Hai Jiang, Hyun-Chul Sagong, Jinju Kim, Hyewon Shim, Yoohwan Kim, Junekyun Park, Taiki Uemura, Yongsung Ji, Taeyoung Jeong, Dongkyun Kwon, Hwasung Rhee, Sangwoo Pae, Brandon Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability of Industrial grade Embedded-STT-MRAM.

Yongsung Ji, Hyunjae Goo, Jungman Lim, Tae-Young Jeong, Taiki Uemura, Gun Rae Kim, Boil Seo, Seungbae Lee, Goeun Park, Jeongmin Jo, Sang-Il Han, Kilho Lee, Junghyuk Lee, Sohee Hwang, Daesop Lee, Suksoo Pyo, Hyun Taek Jung, Shinhee Han, Seungmo Noh, Kiseok Suh, Sungyoung Yoon, Hyeonwoo Nam, Hyewon Hwang, Hai Jiang, J. W. Kim, D. Kwon, Yoonjong Song, K. H. Koh, Hwasung Rhee, Sangwoo Pae, E. Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability on EUV Interconnect Technology for 7nm and beyond.

Tae-Young Jeong, Miji Lee, Yunkyung Jo, Jinwoo Kim, Min Kim, Myungsoo Yeo, Jinseok Kim, Hyunjun Choi, Joosung Kim, Yoojin Jo, Yongsung Ji, Taiki Uemura, Hai Jiang, Dongkyun Kwon, HwaSung Rhee, Sangwoo Pae, Brandon Lee

Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019

Aging-Aware Design Verification Methods Under Real Product Operating Conditions.

Hyewon Shim, Jeongmin Jo, Yoohwan Kim, Bongyong Jeong, Minji Shon, Hai Jiang, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2019

Localized Layout Effect Related Reliability Approach in 8nm FinFETs Technology: From Transistor to Circuit.

Hai Jiang, Hyun-Chul Sagong, Jinju Kim, Junekyun Park, Sangchul Shin, Sangwoo Pae

Proceedings of the IEEE International Reliability Physics Symposium, 2019