Brandon Lee

Orcid: 0000-0002-2566-5557

According to our database1, Brandon Lee authored at least 7 papers between 2019 and 2022.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

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Links

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Bibliography

2022
Accelerator-Based Thermal-Neutron Beam by Compact and Low-Cost Moderator for Soft-Error Evaluation in Semiconductor Devices.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

Thermal-Neutron SER Mitigation by Cobalt-Contact in 7 nm Bulk-FinFET Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2022

2021
Soft-Error Susceptibility in Flip-Flop in EUV 7 nm Bulk-FinFET Technology.
Proceedings of the IEEE International Reliability Physics Symposium, 2021

2020
Advanced Self-heating Model and Methodology for Layout Proximity Effect in FinFET Technology.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

Reliability on EUV Interconnect Technology for 7nm and beyond.
Proceedings of the 2020 IEEE International Reliability Physics Symposium, 2020

2019
Centralized Clinical Trial Imaging Data Management: Practical Guidance from a Comprehensive Cancer Center's Experience.
J. Digit. Imaging, 2019

Advanded Design Verification and Debugging Techniques Based on Optical Fault Isolation Method.
Proceedings of the 2019 International SoC Design Conference, 2019


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