Philippe Dupuy

According to our database1, Philippe Dupuy authored at least 11 papers between 2001 and 2017.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of five.

Timeline

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Links

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Bibliography

2017
Mechanisms of power module source metal degradation during electro-thermal aging.
Microelectron. Reliab., 2017

2015
In-depth investigation of metallization aging in power MOSFETs.
Microelectron. Reliab., 2015

2014
3-D electrothermal simulation of active cycling on smart power MOSFETs during short-circuit and UIS conditions.
Microelectron. Reliab., 2014

Universal mechanisms of Al metallization ageing in power MOSFET devices.
Microelectron. Reliab., 2014

2013
Reliability of power MOSFET-based smart switches under normal and extreme conditions for 24 V battery system applications.
Microelectron. Reliab., 2013

2011
3D Electro-thermal modelling of bonding and metallization ageing effects for reliability improvement of power MOSFETs.
Microelectron. Reliab., 2011

2010
Characterization of alterations on power MOSFET devices under extreme electro-thermal fatigue.
Microelectron. Reliab., 2010

2009
Characterization of ageing failures on power MOSFET devices by electron and ion microscopies.
Microelectron. Reliab., 2009

2007
Characterization and modelling of ageing failures on power MOSFET devices.
Microelectron. Reliab., 2007

2005
Innovative Methodology for Predictive Reliability of Intelligent Power Devices Using Extreme Electro-thermal Fatigue.
Microelectron. Reliab., 2005

2001
Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter.
Microelectron. Reliab., 2001


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