Qijun Lu

Orcid: 0000-0002-0134-0846

According to our database1, Qijun Lu authored at least 15 papers between 2016 and 2026.

Collaborative distances:
  • Dijkstra number2 of five.
  • Erdős number3 of four.

Timeline

Legend:

Book  In proceedings  Article  PhD thesis  Dataset  Other 

Links

Online presence:

On csauthors.net:

Bibliography

2026
Miniaturized on-chip tunable differential diplexer with independently designable bandstop filters for 5G FR2 multiband multistream applications.
Microelectron. J., 2026

High-density double-helix inductor based on coaxial through-silicon via and its analytical model.
Microelectron. J., 2026

A 2-18GHz Tunable Bandpass Filter with Dual-Path Transformer Technique for Ultra-wideband Applications.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2026

A 60-GHz Transformer-Based Broadband 3-way Quadrature-Phase Coupler in 65-nm CMOS.
Proceedings of the IEEE International Symposium on Circuits and Systems, 2026

A 29-40 GHz 6-Bit Phase Filtering Active Phase Shifter with <1.8°/<0.38 dB RMS Phase/Gain Errors for 5G Millimeter-Wave Spatial-Filtering Receivers.
Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

2025
A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2025

Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology.
Microelectron. J., 2025

2024
A W-band compact wide 1-dB bandwidth semi- lumped quadrature coupler in 65 nm CMOS.
Microelectron. J., 2024

2023
Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.
IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

2021
Design of compact LC lowpass filters based on coaxial through-silicon vias array.
Microelectron. J., 2021

2020
Physics based scalable inductance model for three-dimensional solenoid inductors.
Microelectron. J., 2020

Millimeter-Wave Antenna-in-Package Applications Based on D263T Glass Substrate.
IEEE Access, 2020

2019
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J., 2019

2018
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2016
Analysis of propagation delay and repeater insertion in single-walled carbon nanotube bundle interconnects.
Microelectron. J., 2016


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