Xiangkun Yin

Orcid: 0000-0003-2318-1257

According to our database¹, Xiangkun Yin authored at least 24 papers between 2015 and 2026.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

Legend:

Book In proceedings Article PhD thesis Dataset Other

Links

On csauthors.net:

Bibliography

2026

BP-PSO hybrid intelligent optimization for high-density TSV-based 3D transformer with enhanced voltage gain and area efficiency.

[BibT_eX]

[DOI]

Microelectron. J., 2026

Miniaturized on-chip tunable differential diplexer with independently designable bandstop filters for 5G FR2 multiband multistream applications.

[BibT_eX]

[DOI]

Microelectron. J., 2026

High-density double-helix inductor based on coaxial through-silicon via and its analytical model.

[BibT_eX]

[DOI]

Microelectron. J., 2026

2025

A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, February, 2025

Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology.

[BibT_eX]

[DOI]

Microelectron. J., 2025

Towards miniaturization: Reflectionless filter with sharp roll-off characterization based on through-silicon via.

[BibT_eX]

[DOI]

Microelectron. J., 2025

2024

A compact fifth-order SIW BPF based on TSV technology with high selectivity.

[BibT_eX]

[DOI]

Microelectron. J., February, 2024

Effect of annealing residual stress on mobility of TSV vertical switch.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2024

2023

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.

[BibT_eX]

[DOI]

Microelectron. J., 2023

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2023

2022

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2022

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.

[BibT_eX]

[DOI]

Xiangkun Yin

Jingyu Lu

Fengjuan Wang

Microelectron. J., 2022

Compact high-performance dual-frequency power divider based on TSV.

[BibT_eX]

[DOI]

Microelectron. J., 2022

Wideband transmission optimization for heterogenous interconnection in 3D IC.

[BibT_eX]

[DOI]

Xiangkun Yin

Jingyu Lu

Fengjuan Wang

IEICE Electron. Express, 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2022

2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

[BibT_eX]

[DOI]

Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.

[BibT_eX]

[DOI]

Integr., 2021

Analytical models of AC inductance and quality factor for TSV-based inductor.

[BibT_eX]

[DOI]

Xiangkun Yin

Fengjuan Wang

IEICE Electron. Express, 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.

[BibT_eX]

[DOI]

IEEE Access, 2021

2020

Physics based scalable inductance model for three-dimensional solenoid inductors.

[BibT_eX]

[DOI]

Microelectron. J., 2020

2019

Electromagnetic modeling and analysis of the tapered differential through glass vias.

[BibT_eX]

[DOI]

Microelectron. J., 2019

2018

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

[BibT_eX]

[DOI]

Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2015

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2015

Xiangkun Yin

Timeline

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Links

On csauthors.net:

Bibliography

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