Fengjuan Wang

According to our database, Fengjuan Wang authored at least 43 papers between 2007 and 2024.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2024

A compact fifth-order SIW BPF based on TSV technology with high selectivity.

Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li

Microelectron. J., February, 2024

2023

Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.

Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang

Microelectron. J., 2023

TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.

Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2023

2022

A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.

Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEEE Trans. Very Large Scale Integr. Syst., 2022

Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.

Xiangkun Yin, Jingyu Lu, Fengjuan Wang

Microelectron. J., 2022

Compact high-performance dual-frequency power divider based on TSV.

Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang

Microelectron. J., 2022

Wideband transmission optimization for heterogenous interconnection in 3D IC.

Xiangkun Yin, Jingyu Lu, Fengjuan Wang

IEICE Electron. Express, 2022

A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.

Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2022

TSV-based SIW bandpass filter for W-band mobile communication applications.

Fengjuan Wang, Quan Peng, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2022

2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu

Microelectron. J., 2021

A transformer with high coupling coefficient and small area based on TSV.

Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang

Integr., 2021

Analytical models of AC inductance and quality factor for TSV-based inductor.

Xiangkun Yin, Fengjuan Wang

IEICE Electron. Express, 2021

TSV-based hairpin bandpass filter for 6G mobile communication applications.

Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang

IEICE Electron. Express, 2021

A novel optimization method for WSN based on mixed matrix decomposition of NMF and 2-SVD-QR.

Zhiyang Zhao, Baoju Zhang, Bo Zhang, Cuiping Zhang, Man Wang, Wenrui Yan, Fengjuan Wang

Ad Hoc Networks, 2021

Low-light image joint enhancement optimization algorithm based on frame accumulation and multi-scale Retinex.

Fengjuan Wang, Baoju Zhang, Cuiping Zhang, Wenrui Yan, Zhiyang Zhao, Man Wang

Ad Hoc Networks, 2021

Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.

Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang

IEEE Access, 2021

2019

Fiber Ring Laser Directional Torsion Sensor with Ultra-Wide Linear Response.

Xianjin Liu, Fengjuan Wang, Jiuru Yang, Xudong Zhang, Xiliang Du

Sensors, 2019

Investigation on impact of substrate on low-pass filter based on coaxial TSV.

Fengjuan Wang, He Li, Ningmei Yu

IEICE Electron. Express, 2019

A high-pass filter based on through-silicon via (TSV).

Fengjuan Wang, Jia Huang, Ningmei Yu

IEICE Electron. Express, 2019

A Preprocessing Algorithm Based on Heterogeneity Detection for Transmitted Tissue Image.

Chengcheng Zhang, Baoju Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang

EURASIP J. Wirel. Commun. Netw., 2019

Multispectral Heterogeneity Detection Based on Frame Accumulation and Deep Learning.

Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang, Wenrui Yan

IEEE Access, 2019

Single-Channel Grayscale Processing Algorithm for Transmission Tissue Images Based on Heterogeneity Detection.

Baoju Zhang, Chengcheng Zhang, Gang Li, Ling Lin, Cuiping Zhang, Fengjuan Wang

Proceedings of the Communications, Signal Processing, and Systems, 2019

A Multispectral Image Edge Detection Algorithm Based on Improved Canny Operator.

Baoju Zhang, Fengjuan Wang, Gang Li, Cuiping Zhang, Chengcheng Zhang

Proceedings of the Communications, Signal Processing, and Systems, 2019

2018

A novel guard method of through-silicon-via (TSV).

Fengjuan Wang, Jia Huang, Ningmei Yu

IEICE Electron. Express, 2018

Mode locking and quasiperiodicity in a discrete-time Chialvo neuron model.

Fengjuan Wang, Hongjun Cao

Commun. Nonlinear Sci. Numer. Simul., 2018

Longitudinal Clustering of High Cost Patients' Spend Trajectories: Delineating Individual Behaviors from Aggregate Trends.

Andrew Placona, Fengjuan Wang, Rich King

Proceedings of the AMIA 2018, 2018

2017

An Ultracompact Butterworth Low-Pass Filter Based on Coaxial Through-Silicon Vias.

Fengjuan Wang, Ningmei Yu

IEEE Trans. Very Large Scale Integr. Syst., 2017

Equivalent circuit model of through-silicon-via in slow wave mode.

Fengjuan Wang, Gang Wang, Ningmei Yu

IEICE Electron. Express, 2017

Data Munging Tricks Can Build Better High Risk Maternity Predictive Models.

Andrew Placona, Fengjuan Wang, Shantanu Phatakwala, Nick Toure

Proceedings of the AMIA 2017, 2017

2016

Explicit model of thermal stress induced by annular through-silicon-via (TSV).

Fengjuan Wang, Ningmei Yu

IEICE Electron. Express, 2016

Thermal management of coaxial through-silicon-via (C-TSV)-based three-dimensional integrated circuit (3D IC).

Fengjuan Wang, Ningmei Yu

IEICE Electron. Express, 2016

2015

Based on reverse molding technology of the impeller of the fluid dynamics analysis.

Shigang Wang, Yong Yan, Fengjuan Wang, Guanxiong Wu

J. Comput. Methods Sci. Eng., 2015

Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.

Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang

IEICE Electron. Express, 2015

Study on thermal stress and keep-out zone induced by Cu and SiO₂ filled coaxial-annular through-silicon via.

Fengjuan Wang, Ningmei Yu

IEICE Electron. Express, 2015

Parallel Implementation of P Systems for Data Clustering on GPU.

Jie Jin, Hui Liu, Fengjuan Wang, Hong Peng, Jun Wang

Proceedings of the Bio-Inspired Computing - Theories and Applications, 2015

2014

Capacitance characterization of tapered through-silicon-via considering MOS effect.

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

Microelectron. J., 2014

2013

Effect of Inertia Weight w on PSO-SA Algorithm.

Shigang Wang, Fangfang Zhou, Fengjuan Wang

Int. J. Online Biomed. Eng., 2013

Thermo-mechanical performance of Cu and SiO₂ filled coaxial through-silicon-via (TSV).

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

IEICE Electron. Express, 2013

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding

IEICE Electron. Express, 2013

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.

Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding

IEICE Electron. Express, 2013

2011

Is Internal Capital Market of China Listed Companies Efficient? - Empirical Evidences from Listed Companies Which Have Multiple Divisions in H-stock.

Fengjuan Wang, Zhihua Xie

Proceedings of the ICEIS 2011, 2011

A thermal model for the top layer of 3D integrated circuits considering through silicon vias.

Fengjuan Wang, Zhangming Zhu, Yintang Yang, Ning Wang

Proceedings of the 2011 IEEE 9th International Conference on ASIC, 2011

2007

A Facial Sketch Animation Generator for Mobile Communication.

Yuehu Liu, Yuanqi Su, Yang Yang, Fengjuan Wang, Maojun Yuan, Zhen Ren

Proceedings of the IAPR Conference on Machine Vision Applications (IAPR MVA 2007), 2007