Xiaoxian Liu

Orcid: 0000-0001-7177-7640

According to our database¹, Xiaoxian Liu authored at least 33 papers between 2013 and 2026.

Collaborative distances:

Dijkstra number² of five.
Erdős number³ of four.

Timeline

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Book In proceedings Article PhD thesis Dataset Other

Links

On csauthors.net:

Bibliography

2026

An Ultra-Compact Doherty Power Amplifier Based on Reciprocal Three-Coil-Coupled-Network.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, June, 2026

Miniaturized on-chip tunable differential diplexer with independently designable bandstop filters for 5G FR2 multiband multistream applications.

[BibT_eX]

[DOI]

Microelectron. J., 2026

A 29-40 GHz 6-Bit Phase Filtering Active Phase Shifter with <1.8°/<0.38 dB RMS Phase/Gain Errors for 5G Millimeter-Wave Spatial-Filtering Receivers.

[BibT_eX]

[DOI]

Proceedings of the IEEE Custom Integrated Circuits Conference, 2026

2025

Compact On-Chip Half-Mode SIW-Based Dual-Band Bandpass Filter Using 3-D Stacked Inductors With Controllable Transmission Zero.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., April, 2025

α-Forest: Proxy-Cloud Enabled Efficient and Secure Community Search over Encrypted Bipartite Graphs.

[BibT_eX]

[DOI]

Proceedings of the IEEE International Workshop on Information Forensics and Security, 2025

Efficient and Privacy-Preserving (α, β)-Core Community Search over Encrypted Bipartite Graphs.

[BibT_eX]

[DOI]

Proceedings of the 24th IEEE International Conference on Trust, 2025

Online Adaptive Rumor Blocking with Pertinence Set.

[BibT_eX]

[DOI]

Proceedings of the Databases Theory and Applications, 2025

2024

An Evaluation of Ecosystem Quality and Its Response to Aridity on the Qinghai-Tibet Plateau.

[BibT_eX]

[DOI]

Remote. Sens., September, 2024

2023

A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, December, 2023

A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression.

[BibT_eX]

[DOI]

Microelectron. J., March, 2023

A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.

[BibT_eX]

[DOI]

IEEE Trans. Circuits Syst. II Express Briefs, February, 2023

Filtering SIW phase shifter based on through quartz vias technology.

[BibT_eX]

[DOI]

Nuo Liu

Xiaoxian Liu

Chenhui Fan

Microelectron. J., 2023

2022

An effective method to suppress high-order modes of SIW filters with compact size.

[BibT_eX]

[DOI]

Microelectron. J., 2022

2021

Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications.

[BibT_eX]

[DOI]

IEEE Trans. Very Large Scale Integr. Syst., 2021

Design of compact LC lowpass filters based on coaxial through-silicon vias array.

[BibT_eX]

[DOI]

Microelectron. J., 2021

2020

Voltage Reference With Linear-Temperature-Dependent Power Consumption.

[BibT_eX]

[DOI]

Haoyu Zhuang

Xiaoxian Liu

Hao Wang

IEEE Trans. Very Large Scale Integr. Syst., 2020

Voltage Comparator With 60% Faster Speed by Using Charge Pump.

[BibT_eX]

[DOI]

Haoyu Zhuang

He Tang

Xiaoxian Liu

IEEE Trans. Circuits Syst., 2020

Physics based scalable inductance model for three-dimensional solenoid inductors.

[BibT_eX]

[DOI]

Microelectron. J., 2020

2019

Electromagnetic modeling and analysis of the tapered differential through glass vias.

[BibT_eX]

[DOI]

Microelectron. J., 2019

Broadband inductance modeling of TXVs for 3D interconnection.

[BibT_eX]

[DOI]

Microelectron. J., 2019

2018

Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).

[BibT_eX]

[DOI]

IEICE Electron. Express, 2018

Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.

[BibT_eX]

[DOI]

Proceedings of the 2018 IEEE Asia Pacific Conference on Circuits and Systems, 2018

2014

Capacitance characterization of tapered through-silicon-via considering MOS effect.

[BibT_eX]

[DOI]

Microelectron. J., 2014

Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2014

A multiscale region-based approach to automatic SAR image registration using CLPSO.

[BibT_eX]

[DOI]

Proceedings of the 2014 IEEE Geoscience and Remote Sensing Symposium, 2014

2013

Thermo-mechanical performance of Cu and SiO<sub>2</sub> filled coaxial through-silicon-via (TSV).

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588].

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

The impact of trapping centers on AlGaN/GaN resonant tunneling diode.

[BibT_eX]

[DOI]

IEICE Electron. Express, 2013

An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP.

[BibT_eX]

[DOI]

Proceedings of the 12th IEEE International Conference on Trust, 2013

A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization.

[BibT_eX]

[DOI]

Xiaoxian Liu

Rongcai Zhao

Lin Han

Proceedings of the 14th ACIS International Conference on Software Engineering, 2013

Xiaoxian Liu

Timeline

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Links

On csauthors.net:

Bibliography

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