Xiping Jiang

According to our database, Xiping Jiang authored at least 10 papers between 2021 and 2026.

Collaborative distances:

• Dijkstra number of four.
• Erdős number of four.

2026

A Full-Stack Performance Evaluation Infrastructure for 3D-DRAM-based LLM Accelerators.

Cong Li, Chenhao Xue, Yi Ren, Xiping Dong, Yu Cheng, Yinbo Hu, Fujun Bai, Yixin Guo, Xiping Jiang, Qiang Wu, Zhi Yang, Zhe Cheng, Yuan Xie, Guangyu Sun

CoRR, April, 2026

Hardware-Software Co-design for 3D-DRAM-based LLM Serving Accelerator.

Cong Li, Yihan Yin, Chenhao Xue, Zhao Wang, Fujun Bai, Yixin Guo, Xiping Jiang, Qiang Wu, Yuan Xie, Guangyu Sun

CoRR, March, 2026

A 1.2GHz 12.77GB/s/mm² 3D Two-DRAM-One-Logic Process-Near-Memory Chip for Edge LLM Applications.

Yue Cao, Jinghao Jiang, Haijun Jiang, Qian Zhang, Xuanzhi Liu, Jinhui Cheng, Zhongze Han, Xiping Jiang, Fengguo Zuo, Song Wang, Fujun Bai, Yixin Guo, Chunmeng Dou, Jianguo Yang, Hangbing Lv, Qi Liu, Ming Liu

Proceedings of the IEEE International Solid-State Circuits Conference, 2026

2025

A 3D Unified Analysis Method (3D-UAM) for Wafer-on-Wafer Stacked Near-Memory Structure.

Song Wang, Yixin Guo, Wei Tao, Xuerong Jia, Fujun Bai, Jie Tan, Yubing Wang, Liang Bai, Fuzhi Guo, Qi Liu, Jin Li, Peng Yin, Fenning Liu, Jing Liu, Xiaodong Long, Yanwu Han, Zhongcheng Yu, Mengzi Cheng, Song Chen, Xiping Jiang

IEEE Trans. Very Large Scale Integr. Syst., August, 2025

Accurate positioning system in complex environment based on Beidou dual frequency differential positioning technology.

Xiping Jiang, Shihai Zhang, Haiyi Wan, Yongfu Li

Int. J. Inf. Commun. Technol., 2025

2023

Novel Diagnosis Method for GIS Mechanical Defects Based on an Improved Lightweight CNN Model With Load Adaptive Matching.

Yao Zhong, Jian Hao, Qingsong Lliu, Ying Li, Xu Li, Ruijin Liao, Xiping Jiang

IEEE Trans. Ind. Informatics, November, 2023

Research on Field Source Characteristics of Leakage Current of Arrester Based on TMR Sensor.

Yameng Fu, Tanxiao Li, Yongfu Li, Xiaoxu Hu, Xiping Jiang, Yiran Dong, Pengcheng Zhao, Chuanxiang Yu, Jingang Wang

Sensors, 2023

A 135 GBps/Gbit 0.66 pJ/bit Stacked Embedded DRAM with Multilayer Arrays by Fine Pitch Hybrid Bonding and Mini-TSV.

Song Wang, Bing Yu, Wenwu Xiao, Fujun Bai, Xiaodong Long, Liang Bai, Xuerong Jia, Fengguo Zuo, Jie Tan, Yixin Guo, Peng Sun, Jun Zhou, Qiong Zhan, Sheng Hu, Yu Zhou, Yi Kang, Qiwei Ren, Xiping Jiang

Proceedings of the 2023 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits), 2023

2022

184QPS/W 64Mb/mm²3D Logic-to-DRAM Hybrid Bonding with Process-Near-Memory Engine for Recommendation System.

Dimin Niu, Shuangchen Li, Yuhao Wang, Wei Han, Zhe Zhang, Yijin Guan, Tianchan Guan, Fei Sun, Fei Xue, Lide Duan, Yuanwei Fang, Hongzhong Zheng, Xiping Jiang, Song Wang, Fengguo Zuo, Yubing Wang, Bing Yu, Qiwei Ren, Yuan Xie

Proceedings of the IEEE International Solid-State Circuits Conference, 2022

2021

A 1596GB/s 48Gb Embedded DRAM 384-Core SoC with Hybrid Bonding Integration.

Xiping Jiang, Fengguo Zuo, Song Wang, Xiaofeng Zhou, Bing Yu, Yubing Wang, Qi Liu, Ming Liu, Yi Kang, Qiwei Ren

Proceedings of the IEEE Asian Solid-State Circuits Conference, 2021