V. Lapras

According to our database, V. Lapras authored at least 3 papers between 2022 and 2025.

Collaborative distances:

• Dijkstra number of five.
• Erdős number of five.

2025

Fast CV MSM Technique for Comprehensive Analysis of Bulk Trapping in Low-K Carbon-Doped Dielectrics.

Tadeu Mota Frutuoso, William Vandendaele, A. Bond, F. Bringuier, V. Lapras, Marie Claire Cyrille, Claire Fenouillet-Béranger, B. Duriez, Xavier Garros

Proceedings of the IEEE International Reliability Physics Symposium, 2025

2024

First Radio-Frequency Circuits Fabricated in Top-Tier of a Full 3D Sequential Integration Process at mmW for 5G Applications.

J. Luge-Alvarez, J. B. David, Alexandre Siligaris, Vincent Puyal, G. Moritz, Tadeu Mota Frutuoso, V. Lapras, Claire Fenouillet-Béranger, Laurent Brunet, P. Vincent, Didier Lattard, Xavier Garros, François Andrieu, Perrine Batude

Proceedings of the IEEE Symposium on VLSI Technology and Circuits 2024, 2024

2022

Methodology for Active Junction Profile Extraction in thin film FD-SOI Enabling performance driver identification in 500°C devices for 3D sequential integration.

Tadeu Mota Frutuoso, Xavier Garros, Perrine Batude, Laurent Brunet, Joris Lacord, Benoit Sklénard, V. Lapras, Claire Fenouillet-Béranger, M. Ribotta, A. Magalhaes-Lucas, J. Kanyandekwe, R. Kies, G. Romano, Edoardo Catapano, Mikaël Cassé, Jose Lugo-Alvarez, Philippe Ferrari, Fred Gaillard

Proceedings of the IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits 2022), 2022